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SNJ54AC04FK

Texas Instruments

SNJ54AC04FK by Texas Instruments

SNJ54AC04FK by Texas Instruments is a CMOS logic gate with 6 functions, 11ns propagation delay at 3.3V supply, and MIL-PRF-38535 screening. It is used in military-grade applications requiring fast signal processing and operates within -55 to 125°C temperature range.

Median Price

$18.630

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14 parts In-Stock

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-

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$15.830

1k+ parts

$14.160

10k+ parts

$13.330

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$15.830

$14.160

$13.330

DigiKey

USA . 14 parts In-Stock

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-

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$21.430

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$21.430

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Digiode

USA . 2,983 parts In-Stock

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$14.526

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2,983

$14.526

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Vyrian

USA . 8,815 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 39 parts In-Stock

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Holdelec - ElecDif-Pro

France . 39 parts In-Stock

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DigiKey Marketplace

USA . 34 parts In-Stock

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QIE Inc.

USA . 8 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,209 parts In-Stock

1+ parts

$13.761

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3,209

$13.761

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Parana Technologies

USA . 1,534 parts In-Stock

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$25.454

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$26.085

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1,534

$25.454

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$26.085

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DigiPath Technology Company

USA . 1,367 parts In-Stock

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$28.028

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$25.786

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1,367

$28.028

$25.786

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ChromeModa Solutions

Germany . 4,091 parts In-Stock

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$28.600

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$23.452

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4,091

$28.600

$23.452

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IDEA Electronic Components Group

UK . 1,348 parts In-Stock

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$28.600

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$27.170

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$25.740

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$25.740

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Microchip USA

USA . 1,440 parts In-Stock

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$38.890

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$38.340

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$38.060

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$37.780

1,440

$38.890

$38.340

$38.060

$37.780

QUARKTWIN TECHNOLOGY LTD

USA . 4,880 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Elevate your electronic projects with the high-quality SNJ54AC04FK logic gates by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers reliable components that meet stringent MIL-PRF-38535 screening levels. With a fast propagation delay of 11ns and compatibility with various power supplies, this versatile chip carrier package is ideal for a wide range of applications. Whether you're working on automotive systems, industrial controls, or consumer electronics, the SNJ54AC04FK offers unmatched performance and efficiency. Upgrade your designs today with Texas Instruments' trusted technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package material ensures durability and resistance to heat, making the product reliable for long-term use.

Propagation Delay at Nominal Supply: 11 ns

Low propagation delay ensures fast operation, making the product suitable for applications requiring quick response times.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

No. of Functions: 6

Multiple functions within one component provide versatility and efficiency in circuit design.

Screening Level: MIL-PRF-38535

High screening level ensures reliability and compliance with military standards for critical applications.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable voltage supply for efficient performance and compatibility with standard power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable operation and reduced power consumption.

Maximum Operating Temperature: 125 °C

Wide range of operating temperature allows for versatility in different environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Logic Gates SNJ54AC04FK attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SNJ54AC04FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-265-4711, 5962012654711

NIIN

012654711

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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