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SNJ54ABT823FK

Texas Instruments

SNJ54ABT823FK by Texas Instruments

SNJ54ABT823FK by Texas Instruments is a 9-bit bus driver with 8.1ns propagation delay, suitable for military applications. It operates at a supply voltage of 5V, has a max frequency of 125MHz, and features independent control for two ports.

Median Price

$50.972

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,743 parts In-Stock

1+ parts

$50.972

100+ parts

$45.308

1k+ parts

$33.315

10k+ parts

-

1,743

$50.972

$45.308

$33.315

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,567 parts In-Stock

1+ parts

$48.423

100+ parts

-

1k+ parts

-

10k+ parts

-

1,567

$48.423

-

-

-

Vyrian

USA . 4,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,842 parts In-Stock

1+ parts

$4.539

100+ parts

-

1k+ parts

$4.358

10k+ parts

$4.358

1,842

$4.539

-

$4.358

$4.358

AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$17.780

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$17.780

-

-

-

Parana Technologies

USA . 1,125 parts In-Stock

1+ parts

$21.085

100+ parts

$1,958.061

1k+ parts

$18.976

10k+ parts

-

1,125

$21.085

$1,958.061

$18.976

-

DigiPath Technology Company

USA . 1,472 parts In-Stock

1+ parts

$23.217

100+ parts

-

1k+ parts

-

10k+ parts

-

1,472

$23.217

-

-

-

ChromeModa Solutions

Germany . 6,891 parts In-Stock

1+ parts

$23.691

100+ parts

$19.427

1k+ parts

-

10k+ parts

-

6,891

$23.691

$19.427

-

-

IDEA Electronic Components Group

UK . 1,131 parts In-Stock

1+ parts

$23.691

100+ parts

$22.506

1k+ parts

$21.322

10k+ parts

-

1,131

$23.691

$22.506

$21.322

-

Ampacity Inc.

Singapore . 1,683 parts In-Stock

1+ parts

$43.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$43.330

-

-

-

Corphita

USA . 233 parts In-Stock

1+ parts

$45.875

100+ parts

-

1k+ parts

-

10k+ parts

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233

$45.875

-

-

-

Microchip USA

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,390

-

-

-

-

Overview

Experience unparalleled reliability and performance with the SNJ54ABT823FK by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-quality products that exceed expectations. The SNJ54ABT823FK is a versatile bus driver & transceiver suitable for a wide range of applications. With fast propagation delay and 3-state output characteristics, this chip carrier package offers seamless integration and efficient operation. Trust Texas Instruments to deliver cutting-edge technology that enhances your projects and provides exceptional value to customers. Elevate your designs with the SNJ54ABT823FK today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 8.1 ns

The low propagation delay ensures fast and efficient signal transmission, ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Screening Level: MIL-PRF-38535

Meets stringent military screening standards for quality and reliability, ensuring consistent performance in demanding conditions.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy integration into existing circuit designs.

No. of Bits: 9

9 bits allows for versatile data transmission and processing capabilities, suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with most electronics and power sources.

Load Capacitance (CL): 50 pF

Optimized load capacitance ensures stable operation and minimizes signal distortion, improving overall performance.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable and stable performance under varying conditions.

No. of Terminals: 28

Ample terminals allow for easy connectivity and integration within complex systems and circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact and efficient packaging, ideal for space-constrained applications.

Maximum I (ol): 48 Amp

High output current capacity supports robust signal transmission and handling, suitable for demanding applications.

Propagation Delay (tpd): 7 ns

Low propagation delay ensures fast response times and efficient signal processing in real-time applications.

Maximum Operating Temperature: 125 °C

Operating temperature range up to 125°C allows for reliable performance in high-temperature environments.

Output Characteristics: 3-STATE

3-state output allows for flexible control of signal lines, enabling efficient communication protocols and data transfer.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures accurate data sampling and processing, enhancing reliability in critical operations.

Minimum Operating Temperature: -55 °C

Wide temperature range from -55°C enables operation in harsh cold environments, expanding the product's utility.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers reliable connections and solderability, ensuring long-term performance and stability.

Terminal Position: QUAD

Quad terminal position facilitates easy installation and connection within circuit boards and systems.

No. of Ports: 2

2 ports provide multiple connection options and increased flexibility for data routing and switching.

Maximum Seated Height: 2.03 mm

Low seated height allows for compact and space-efficient design integration, suitable for slim devices and PCB layouts.

Width: 11.43 mm

Width dimension of 11.43mm offers a balance of size and functionality, fitting well within standard equipment configurations.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and compatibility with industry-standard communication protocols.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement of 4.5V allows for operation in low-power scenarios, saving energy and reducing costs.

Length: 11.43 mm

Length dimension of 11.43mm offers a compact form factor, suitable for integration into space-constrained applications.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in extreme environmental conditions and demanding applications.

Maximum Frequency At Nominal Supply: 125000000 Hz

High frequency support allows for fast data processing and transmission, suitable for high-performance communication systems.

Technology: BICMOS

BiCMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures compatibility with modern electronics manufacturing processes.

Packing Method: TUBE

Tube packing method offers efficient storage and handling during transportation and assembly processes.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27mm allows for precise and reliable connections, reducing the risk of signal interference or connectivity issues.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies signal routing and operation, ensuring consistent and predictable data transmission.

Control Type: INDEPENDENT CONTROL

Independent control feature allows for customized signal management and data handling, enhancing system flexibility and efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5V provides a safety margin and prevents damage from voltage spikes or fluctuations.

Maximum Power Supply Current (ICC): 38 mA

Low power supply current consumption of 38mA ensures energy efficiency and minimizes heat generation, suitable for battery-powered applications.

Technical Specifications

Bus Driver & Transceivers SNJ54ABT823FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND CLOCK ENABLE

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e0

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

48 Amp

No. of Bits:

9

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

8.1 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

11.43 mm

Trade Compliance

SNJ54ABT823FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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