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SNJ54ABT573W

Texas Instruments

SNJ54ABT573W by Texas Instruments

SNJ54ABT573W by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.7 ns at 5V, suitable for military applications. It features a flatpack package style, operates in temperatures ranging from -55 to 125 °C, and has a max power supply current of 30 mA.

Median Price

$23.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,083 parts In-Stock

1+ parts

$23.140

100+ parts

$20.213

1k+ parts

$13.940

10k+ parts

-

1,083

$23.140

$20.213

$13.940

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,234 parts In-Stock

1+ parts

$21.983

100+ parts

-

1k+ parts

-

10k+ parts

-

1,234

$21.983

-

-

-

Vyrian

USA . 6,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,110

-

-

-

-

Resion

USA . 94 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

94

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,635 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

$2.636

10k+ parts

$2.636

2,635

$2.746

-

$2.636

$2.636

Parana Technologies

USA . 1,919 parts In-Stock

1+ parts

$7.860

100+ parts

$729.965

1k+ parts

$7.074

10k+ parts

-

1,919

$7.860

$729.965

$7.074

-

DigiPath Technology Company

USA . 66 parts In-Stock

1+ parts

$8.655

100+ parts

$7.963

1k+ parts

-

10k+ parts

-

66

$8.655

$7.963

-

-

ChromeModa Solutions

Germany . 4,595 parts In-Stock

1+ parts

$8.832

100+ parts

$7.242

1k+ parts

-

10k+ parts

-

4,595

$8.832

$7.242

-

-

IDEA Electronic Components Group

UK . 1,942 parts In-Stock

1+ parts

$8.832

100+ parts

$8.390

1k+ parts

$7.949

10k+ parts

-

1,942

$8.832

$8.390

$7.949

-

AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$13.610

100+ parts

-

1k+ parts

-

10k+ parts

-

680

$13.610

-

-

-

Corphita

USA . 3,103 parts In-Stock

1+ parts

$20.826

100+ parts

-

1k+ parts

-

10k+ parts

-

3,103

$20.826

-

-

-

Ampacity Inc.

Singapore . 1,044 parts In-Stock

1+ parts

$42.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$42.810

-

-

-

Microchip USA

USA . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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968

-

-

-

-

Overview

Enhance your electronic circuits with the Texas Instruments SNJ54ABT573W! This high-quality bus driver and transceiver offers unmatched reliability and performance, thanks to Texas Instruments' renowned expertise in semiconductor manufacturing. Ideal for a wide range of applications, this product provides seamless communication between different parts of your system. Experience the value of faster signal propagation, increased efficiency, and enhanced overall functionality with the SNJ54ABT573W. Upgrade your projects today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring the component can withstand harsh environments and operate reliably for an extended period of time.

Propagation Delay At Nominal Supply: 6.7 ns

Low propagation delay ensures fast signal transmission, making this product ideal for applications requiring quick response times.

Surface Mount: YES

Makes it easy to integrate into circuit boards, simplifying the assembly process and saving space.

Package Shape: RECTANGULAR

Compact rectangular shape allows for efficient PCB layout and space-saving design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making integration into existing systems straightforward.

Output Characteristics: 3-STATE

3-state output allows for high flexibility in controlling signal flow, enabling multiple devices to share the same bus without conflict.

Technology: BICMOS

Utilizes BiCMOS technology for a combination of the speed of bipolar technology and the low power consumption of CMOS, providing an optimal balance for efficient operation.

Technical Specifications

Bus Driver & Transceivers SNJ54ABT573W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.54 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

SNJ54ABT573W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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