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SNJ54ABT533J

Texas Instruments

SNJ54ABT533J by Texas Instruments

SNJ54ABT533J by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns and operates at a supply voltage of 5V. It features a MIL-PRF-38535 screening level, suitable for military-grade applications requiring fast signal transmission and low power consumption. The package style is in-line with through-hole terminals, making it ideal for unidirectional control in compact electronic systems.

Median Price

$47.686

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,580 parts In-Stock

1+ parts

$47.686

100+ parts

$42.387

1k+ parts

$31.167

10k+ parts

-

1,580

$47.686

$42.387

$31.167

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,966 parts In-Stock

1+ parts

$45.302

100+ parts

-

1k+ parts

-

10k+ parts

-

3,966

$45.302

-

-

-

Vyrian

USA . 5,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,977

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,983 parts In-Stock

1+ parts

$5.573

100+ parts

-

1k+ parts

$5.350

10k+ parts

$5.350

2,983

$5.573

-

$5.350

$5.350

Parana Technologies

USA . 496 parts In-Stock

1+ parts

$11.665

100+ parts

-

1k+ parts

$12.058

10k+ parts

-

496

$11.665

-

$12.058

-

DigiPath Technology Company

USA . 1,028 parts In-Stock

1+ parts

$12.845

100+ parts

$11.817

1k+ parts

-

10k+ parts

-

1,028

$12.845

$11.817

-

-

ChromeModa Solutions

Germany . 6,587 parts In-Stock

1+ parts

$13.107

100+ parts

$10.748

1k+ parts

-

10k+ parts

-

6,587

$13.107

$10.748

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IDEA Electronic Components Group

UK . 402 parts In-Stock

1+ parts

$13.107

100+ parts

$12.452

1k+ parts

$11.796

10k+ parts

-

402

$13.107

$12.452

$11.796

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$21.580

100+ parts

-

1k+ parts

-

10k+ parts

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626

$21.580

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Corphita

USA . 2,844 parts In-Stock

1+ parts

$42.917

100+ parts

-

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10k+ parts

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2,844

$42.917

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Microchip USA

USA . 2,881 parts In-Stock

1+ parts

-

100+ parts

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2,881

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Overview

Elevate your electronic designs with the SNJ54ABT533J by Texas Instruments. This high-quality bus driver & transceiver offers unmatched reliability and performance, thanks to its MIL-PRF-38535 screening level and advanced BICMOS technology. Perfect for various applications, this 8-bit component provides a seamless interface while ensuring a fast propagation delay of 6.9 ns. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product will deliver exceptional value, efficiency, and precision to your projects. Upgrade your circuits today and experience the difference with the SNJ54ABT533J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package ensures durability and reliability, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 6.9 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed applications.

Screening Level: MIL-PRF-38535

MIL-PRF-38535 screening level ensures high quality and reliability, meeting military standards for performance.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with a wide range of systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for multiple bus drivers to share a common line, enabling efficient bus management.

Technology: BICMOS

Utilizing BiCMOS technology provides a good balance between speed and power consumption, making it a versatile choice for various applications.

Technical Specifications

Bus Driver & Transceivers SNJ54ABT533J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.62 mm

Trade Compliance

SNJ54ABT533J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-470-6317, 5962014706317

NIIN

014706317

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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