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SNJ54ABT374FK

Texas Instruments

SNJ54ABT374FK by Texas Instruments

SNJ54ABT374FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.6 ns, operating at a supply voltage of 5V. It features 3-STATE output characteristics and positive edge trigger type, suitable for military-grade applications requiring high-speed data transmission up to 150MHz.

Median Price

$22.583

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 997 parts In-Stock

1+ parts

$22.583

100+ parts

$19.726

1k+ parts

$13.604

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997

$22.583

$19.726

$13.604

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Distributors (In-Stock)

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Freelance Electronics

USA . 10 parts In-Stock

1+ parts

$15.974

100+ parts

$16.772

1k+ parts

$15.814

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10

$15.974

$16.772

$15.814

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Bristol Electronics

USA . 11 parts In-Stock

1+ parts

$16.800

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11

$16.800

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Digiode

USA . 4,293 parts In-Stock

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$21.454

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4,293

$21.454

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Vyrian

USA . 4,707 parts In-Stock

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4,707

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Resion

USA . 144 parts In-Stock

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144

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Beltway Electronics Company

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$13.840

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828

$13.840

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Parana Technologies

USA . 233 parts In-Stock

1+ parts

$16.809

100+ parts

$1,561.011

1k+ parts

$15.128

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233

$16.809

$1,561.011

$15.128

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DigiPath Technology Company

USA . 1,978 parts In-Stock

1+ parts

$18.509

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1,978

$18.509

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ChromeModa Solutions

Germany . 1,919 parts In-Stock

1+ parts

$18.887

100+ parts

$15.487

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1,919

$18.887

$15.487

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$18.887

100+ parts

$17.943

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$16.998

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709

$18.887

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Corphita

USA . 2,136 parts In-Stock

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$20.325

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$20.325

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$24.581

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$22.369

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$20.156

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3,000

$24.581

$22.369

$20.156

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Microchip USA

USA . 2,106 parts In-Stock

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Overview

Enhance your electronic designs with the SNJ54ABT374FK by Texas Instruments, a high-quality bus driver and transceiver that offers reliable performance and durability. Manufactured with precision using ceramic and metal-sealed cofired materials, this chip carrier package device features a 3-state output and positive edge trigger type, making it ideal for a variety of applications. With a fast propagation delay of 7.6 ns and a maximum frequency of 150 MHz, this military-grade component ensures efficient data transmission. Trust in Texas Instruments for cutting-edge technology that delivers top-notch results in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and resistance to harsh environments, making it suitable for long-term use in various conditions.

Propagation Delay At Nominal Supply: 7.6 ns

Low propagation delay ensures fast and efficient data transmission, ideal for high-speed communication applications.

Surface Mount: YES

Enables easy and secure mounting on printed circuit boards, simplifying the manufacturing process.

Screening Level: MIL-PRF-38535

Compliance with military screening standards ensures high reliability and performance, making it suitable for critical applications.

No. of Bits: 8

Offers a sufficient number of bits for data processing, suitable for various bus communication protocols.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, ensuring compatibility with standard power sources.

Output Characteristics: 3-STATE

3-state outputs allow for high flexibility in controlling bus lines, enabling multiple devices to share a communication channel.

Technology: BICMOS

Utilizes BiCMOS technology for a balance of speed and power efficiency, delivering optimal performance in bus driver applications.

Technical Specifications

Bus Driver & Transceivers SNJ54ABT374FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

7.6 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54ABT374FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-435-8152, 5962014358152

NIIN

014358152

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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