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SNC54L121W

Texas Instruments

SNC54L121W by Texas Instruments

Texas Instruments SNC54L121W is a MIL-STD-883 Class B Prescaler & Multivibrator with 14 terminals. Operating temperature range from -55°C to 125°C, suitable for military applications. TTL technology, ceramic package, and flat terminal form make it ideal for robust electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,263 parts In-Stock

1+ parts

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4,263

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Digiode

USA . 4,120 parts In-Stock

1+ parts

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4,120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,519 parts In-Stock

1+ parts

$9.770

100+ parts

$907.332

1k+ parts

$8.793

10k+ parts

-

1,519

$9.770

$907.332

$8.793

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AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$10.127

100+ parts

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361

$10.127

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DigiPath Technology Company

USA . 672 parts In-Stock

1+ parts

$10.758

100+ parts

-

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672

$10.758

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$10.978

100+ parts

$10.429

1k+ parts

$9.880

10k+ parts

-

2,327

$10.978

$10.429

$9.880

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ChromeModa Solutions

Germany . 2,034 parts In-Stock

1+ parts

$10.978

100+ parts

$9.002

1k+ parts

-

10k+ parts

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2,034

$10.978

$9.002

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One Stop Electronics

USA . 986 parts In-Stock

1+ parts

$49.000

100+ parts

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986

$49.000

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Corphita

USA . 4,981 parts In-Stock

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4,981

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Overview

Discover the unmatched reliability and precision of the SNC54L121W by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance with this Prescaler & Multivibrators category product. Perfect for military-grade applications, this product offers customers exceptional value, efficiency, and versatility. Trust in Texas Instruments to provide you with the cutting-edge technology you need for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and stability, making it ideal for high temperature applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and facilitating automated assembly processes.

Screening Level: MIL-STD-883 Class B (Modified)

Ensures high reliability and quality standards, making it suitable for critical military and aerospace applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and routing on PCBs, maximizing space utilization.

No. of Terminals: 14

Provides ample connectivity options for integrating the device into complex circuit designs.

Package Style (Meter): FLATPACK

Flatpack style offers a low profile and compact form factor, suitable for applications with space constraints.

Maximum Operating Temperature: 125 °C

Can operate reliably in high temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely cold conditions, widening its range of potential applications.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting orientations, accommodating various PCB layouts.

Temperature Grade: MILITARY

Designed to meet stringent military standards for performance and reliability in harsh environments.

Technology: TTL

Utilizes TTL technology for fast and reliable digital signal processing, suitable for high-speed applications.

Terminal Form: FLAT

Flat terminal form ensures secure connections and easy soldering during assembly.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for dense packing of components on PCBs, enabling compact circuit designs.

Technical Specifications

Prescaler & Multivibrators SNC54L121W attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54L121W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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