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SNC54HC123FK

Texas Instruments

SNC54HC123FK by Texas Instruments

SNC54HC123FK by Texas Instruments is a CMOS prescaler & multivibrator chip carrier with 20 terminals. It operates b/w -55°C to 125°C, suitable for military applications. With power supplies of 2/6V, it features MIL-STD-883 Class B screening level and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,308 parts In-Stock

1+ parts

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3,308

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Vyrian

USA . 2,569 parts In-Stock

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2,569

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$5.298

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482

$5.298

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Parana Technologies

USA . 2,239 parts In-Stock

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$23.710

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$24.335

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2,239

$23.710

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$24.335

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DigiPath Technology Company

USA . 1,990 parts In-Stock

1+ parts

$26.107

100+ parts

$24.019

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1,990

$26.107

$24.019

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IDEA Electronic Components Group

UK . 2,159 parts In-Stock

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$26.640

100+ parts

$25.308

1k+ parts

$23.976

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2,159

$26.640

$25.308

$23.976

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ChromeModa Solutions

Germany . 1,702 parts In-Stock

1+ parts

$26.640

100+ parts

$21.845

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1,702

$26.640

$21.845

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One Stop Electronics

USA . 1,067 parts In-Stock

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$39.000

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1,067

$39.000

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Corphita

USA . 4,307 parts In-Stock

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4,307

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Overview

Discover the cutting-edge SNC54HC123FK by Texas Instruments, a top-tier manufacturer known for its high-quality electronic components. This Prescaler & Multivibrator offers unparalleled performance and reliability, making it ideal for a wide range of applications. With advanced technology and military-grade temperature grade, this product ensures optimal functionality in even the most demanding environments. Experience the value and benefits of Texas Instruments with the SNC54HC123FK, providing customers with exceptional quality and efficiency that sets them apart from the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good thermal and electrical insulation, ensuring stable performance even in harsh environments.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into electronic circuits, saving space and reducing assembly time.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures high reliability and quality, making this product suitable for mission-critical applications.

Power Supplies (V): 2/6

Support for multiple power supply voltages provides flexibility in system design and compatibility with various power sources.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functions, enabling complex circuit designs and integration with other components.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures stable performance in a wide range of environmental conditions, suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

Low operating temperature range allows for reliable operation in extreme cold environments, expanding the product's usability in harsh conditions.

Temperature Grade: MILITARY

Military-grade temperature range and reliability specifications make this product suitable for demanding military and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting and precise connections, making the product ideal for compact electronic designs and space-constrained applications.

Technical Specifications

Prescaler & Multivibrators SNC54HC123FK attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54HC123FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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