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SNC54HC221FK

Texas Instruments

SNC54HC221FK by Texas Instruments

SNC54HC221FK by Texas Instruments is a CMOS prescaler with 20 terminals in a square chip carrier package. It operates b/w -55°C to 125°C, suitable for military-grade applications. With power supplies of 2/6V, it offers reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,649 parts In-Stock

1+ parts

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100+ parts

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2,649

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Digiode

USA . 726 parts In-Stock

1+ parts

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726

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,998 parts In-Stock

1+ parts

$8.485

100+ parts

-

1k+ parts

$9.138

10k+ parts

-

1,998

$8.485

-

$9.138

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AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$8.502

100+ parts

-

1k+ parts

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878

$8.502

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DigiPath Technology Company

USA . 2,349 parts In-Stock

1+ parts

$9.343

100+ parts

-

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10k+ parts

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2,349

$9.343

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ChromeModa Solutions

Germany . 4,270 parts In-Stock

1+ parts

$9.534

100+ parts

$7.818

1k+ parts

-

10k+ parts

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4,270

$9.534

$7.818

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IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$9.534

100+ parts

$9.057

1k+ parts

$8.581

10k+ parts

-

619

$9.534

$9.057

$8.581

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One Stop Electronics

USA . 1,277 parts In-Stock

1+ parts

$56.000

100+ parts

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1,277

$56.000

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Corphita

USA . 747 parts In-Stock

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747

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Overview

Elevate your electronic projects with the SNC54HC221FK by Texas Instruments, a high-quality prescaler & multivibrator that offers unmatched performance and reliability. Proudly manufactured by Texas Instruments, this versatile component is perfect for a wide range of applications in military-grade environments. With its robust construction and innovative technology, this chip carrier package ensures optimal functionality even in extreme temperatures. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SNC54HC221FK, providing you with the competitive edge you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high temperature resistance, ensuring reliability and durability in harsh environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Screening Level: MIL-STD-883 Class B (Modified)

Adheres to strict military standards, ensuring high quality and reliability for critical applications.

Power Supplies (V): 2/6

Provides flexibility in power supply options, making it compatible with a range of systems and configurations.

No. of Terminals: 20

Offers ample connectivity for various input and output signals, allowing for versatile use in different circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style minimizes footprint and maximizes space efficiency on the PCB, ideal for compact designs.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for applications that require extended use in elevated thermal conditions.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperatures, making it suitable for a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal position provides secure and stable connections, reducing the risk of signal interference or loss.

Temperature Grade: MILITARY

Designed to meet rigorous military temperature standards, ensuring performance in challenging environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, efficient for battery-powered and noise-sensitive applications.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and complies with RoHS regulations, promoting sustainability and safety.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for precise and compact layout on the PCB, enabling high-density integration of components.

Technical Specifications

Prescaler & Multivibrators SNC54HC221FK attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54HC221FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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