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CD74HCT221EE4

Texas Instruments

CD74HCT221EE4 by Texas Instruments

CD74HCT221EE4 by Texas Instruments is a dual-function CMOS device with 2 bits, operating at a supply voltage of 5V. It features a propagation delay of 63ns and max power supply current of 0.08mA. Ideal for military-grade applications requiring prescaling and multivibrator functions in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,576 parts In-Stock

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6,576

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Digiode

USA . 3,139 parts In-Stock

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3,139

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Distributors (Availability)

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Native Components

USA . 433 parts In-Stock

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$0.302

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-

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$0.290

433

$0.302

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$0.290

Northwest PG Solutions

USA . 167 parts In-Stock

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$0.333

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-

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$0.293

167

$0.333

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$0.293

AZTECH Wire

Italy . 597 parts In-Stock

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$12.771

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597

$12.771

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Parana Technologies

USA . 1,392 parts In-Stock

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$13.506

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$14.013

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1,392

$13.506

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$14.013

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ChromeModa Solutions

Germany . 5,165 parts In-Stock

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$15.175

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$12.444

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$15.175

$12.444

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IDEA Electronic Components Group

UK . 466 parts In-Stock

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$15.175

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$14.416

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$13.658

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466

$15.175

$14.416

$13.658

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One Stop Electronics

USA . 1,054 parts In-Stock

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$24.000

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Corphita

USA . 2,055 parts In-Stock

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DigiPath Technology Company

USA . 893 parts In-Stock

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$13.682

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893

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$13.682

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Perfect Parts

USA . 157 parts In-Stock

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Overview

Elevate your electronic projects with the CD74HCT221EE4 by Texas Instruments, a high-quality prescaler and multivibrator that combines reliability and performance. With Texas Instruments' reputation for excellence in the industry, this versatile component is ideal for various applications. Experience seamless functionality and precision with its complementary output polarity and rapid propagation delay of 63 ns. Trust in the value and benefits that this product offers, providing customers with enhanced efficiency and innovative solutions for their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the prescaler & multivibrators, ensuring a long lifespan.

No. of Functions: 2

Having multiple functions in one device can help save space on a circuit board and streamline the overall design.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage, making it compatible with many existing systems.

Propagation Delay (tpd): 63 ns

Low propagation delay ensures fast signal processing and reduces latency in the circuit.

Temperature Grade: MILITARY

Designed to withstand extreme temperature ranges, making it suitable for use in harsh environments or industrial applications.

Technical Specifications

Prescaler & Multivibrators CD74HCT221EE4 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

NON-RETRIGGERABLE

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

63 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HCT221EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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