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SNC54HC123FH

Texas Instruments

SNC54HC123FH by Texas Instruments

SNC54HC123FH by Texas Instruments is a CMOS prescaler with 20 terminals in a ceramic chip carrier package. It operates b/w -55 to 125°C, suitable for military applications. With power supplies of 2/6V, it features MIL-STD-883 Class B screening and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,451 parts In-Stock

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6,451

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Digiode

USA . 3,151 parts In-Stock

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3,151

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Distributors (Availability)

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AZTECH Wire

Italy . 615 parts In-Stock

1+ parts

$9.425

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615

$9.425

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Parana Technologies

USA . 1,773 parts In-Stock

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$28.982

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$53.950

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1,773

$28.982

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$53.950

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ChromeModa Solutions

Germany . 1,954 parts In-Stock

1+ parts

$32.564

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$26.702

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$32.564

$26.702

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IDEA Electronic Components Group

UK . 421 parts In-Stock

1+ parts

$32.564

100+ parts

$30.936

1k+ parts

$29.308

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421

$32.564

$30.936

$29.308

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One Stop Electronics

USA . 157 parts In-Stock

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$56.000

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157

$56.000

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Corphita

USA . 2,763 parts In-Stock

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2,763

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DigiPath Technology Company

USA . 1,737 parts In-Stock

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$29.360

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1,737

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$29.360

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Overview

Elevate your electronic designs with the high-quality SNC54HC123FH by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch products that meet stringent standards, making this prescaler & multivibrator an ideal choice for a wide range of applications. With its ceramic package body material, MIL-STD-883 Class B screening level, and military-grade temperature grade, this chip carrier ensures reliable performance even in challenging environments. Trust Texas Instruments to provide innovative solutions that offer exceptional value, benefits, and advantages to customers looking to elevate their projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity, making it ideal for applications where temperature stability is crucial.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, saving time and costs.

Screening Level: MIL-STD-883 Class B (Modified)

Meeting military standards ensures high reliability and performance in demanding environments.

Package Shape: SQUARE

Square packages offer efficient use of board space and easier alignment during assembly.

Power Supplies (V): 2/6

Support for a range of power supplies allows flexibility in design and compatibility with various systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections, enabling more functionality and versatility in use.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal properties and protection for the integrated circuit inside.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in elevated temperature conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in a wide range of environments, including extreme cold conditions.

Terminal Position: QUAD

Quad terminal position enables secure and stable connections for enhanced reliability.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures the product can withstand harsh conditions and remain operational in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Terminal Form: NO LEAD

No lead terminal form is more environmentally friendly and complies with regulations on hazardous materials.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for densely packed components and saves board space without sacrificing connectivity.

Technical Specifications

Prescaler & Multivibrators SNC54HC123FH attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54HC123FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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