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SNC54L121T

Texas Instruments

SNC54L121T by Texas Instruments

The Texas Instruments SNC54L121T is a TTL technology prescaler with 14 terminals in a flatpack package. Operating temperature range from -55°C to 125°C makes it suitable for military applications. It features MIL-STD-883 Class B screening and is surface mountable, ideal for robust electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,319 parts In-Stock

1+ parts

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6,319

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Digiode

USA . 703 parts In-Stock

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703

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,048 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,048

$8.000

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AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$10.097

100+ parts

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251

$10.097

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Parana Technologies

USA . 2,311 parts In-Stock

1+ parts

$13.467

100+ parts

$1,250.660

1k+ parts

$12.121

10k+ parts

-

2,311

$13.467

$1,250.660

$12.121

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DigiPath Technology Company

USA . 1,599 parts In-Stock

1+ parts

$14.829

100+ parts

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10k+ parts

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1,599

$14.829

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ChromeModa Solutions

Germany . 6,661 parts In-Stock

1+ parts

$15.132

100+ parts

$12.408

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6,661

$15.132

$12.408

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IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$15.132

100+ parts

$14.375

1k+ parts

$13.619

10k+ parts

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109

$15.132

$14.375

$13.619

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Corphita

USA . 4,242 parts In-Stock

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4,242

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Overview

Unleash the power of precision engineering with the SNC54L121T by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability in every product they create. The SNC54L121T falls under the category of Prescaler & Multivibrators, making it an essential component for various electronic applications. With its durable metal body material and MIL-STD-883 Class B screening level, this product offers unmatched performance even in the most demanding environments. Trust Texas Instruments to deliver value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and protection to the internal components, making it suitable for rugged applications.

Surface Mount: YES

Surface mount capability allows for easy PCB assembly.

Screening Level: MIL-STD-883 Class B (Modified)

High screening level ensures reliability and quality performance in critical applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space and easy integration into existing designs.

No. of Terminals: 14

Ample number of terminals provides flexibility in connectivity options.

Package Style (Meter): FLATPACK

Flatpack style offers a low profile design which is suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and performance in demanding environments.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows for use in extreme temperature conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections.

Temperature Grade: MILITARY

Military grade temperature rating ensures ruggedness and reliability in harsh operating conditions.

Technology: TTL

TTL technology offers high speed and reliability in signal processing applications.

Terminal Form: FLAT

Flat terminal form simplifies PCB assembly and ensures secure connections.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high density mounting and compact PCB design.

Technical Specifications

Prescaler & Multivibrators SNC54L121T attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

R-MDFP-F14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54L121T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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