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MC14538BDT

Onsemi

MC14538BDT by Onsemi

MC14538BDT by Onsemi is a Prescaler & Multivibrator with 2 functions, operating at 5V. It has a propagation delay of 600ns and can withstand temperatures from -55 to 125°C. Ideal for military-grade applications requiring precise timing and signal processing in compact spaces.

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Digiode

USA . 1,574 parts In-Stock

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Vyrian

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Halfin

Belgium . 95 parts In-Stock

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Nova Conductors

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PC Components Company LLC

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Bristol Electronics

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AZTECH Wire

Italy . 715 parts In-Stock

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Ampacity Inc.

Singapore . 1,338 parts In-Stock

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Semicontronic

India . 1,367 parts In-Stock

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Lixinc

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Kulean Microsystems

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Continental Prestige Electronics

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SupplyDigital Components

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Problanco Electronics

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TANS Electronics

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Corphita

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UHIMA Technologies

Türkiye . 747 parts In-Stock

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Corohmni

South Africa . 473 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 69 parts In-Stock

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Overview

Unlock the power of precision with the MC14538BDT by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Prescaler & Multivibrators that offer reliable performance and durability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. With a nominal supply voltage of 5V and a dual terminal position, the MC14538BDT ensures smooth operation and exceptional results. Experience the advantage of cutting-edge technology and seamless functionality with Onsemi's MC14538BDT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it long-lasting and reliable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Provides flexibility and versatility in circuit design, allowing for multiple functions within a single component.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and standard voltage level, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 600 ns

Fast propagation delay allows for quick signal processing and response, improving overall performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding industrial and military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Prescaler & Multivibrators MC14538BDT attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC14538BDT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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