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SN74L123J

Texas Instruments

SN74L123J by Texas Instruments

SN74L123J by Texas Instruments is a TTL technology Prescaler & Multivibrator with 16 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The ceramic package body material ensures durability and reliability in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,891 parts In-Stock

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8,891

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Digiode

USA . 1,774 parts In-Stock

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1,774

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DF Sales Co.

USA . 49 parts In-Stock

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49

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DF Sales Co.

USA . 49 parts In-Stock

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49

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$16.166

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260

$16.166

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Parana Technologies

USA . 1,936 parts In-Stock

1+ parts

$17.589

100+ parts

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$17.782

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1,936

$17.589

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$17.782

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DigiPath Technology Company

USA . 450 parts In-Stock

1+ parts

$19.368

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450

$19.368

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ChromeModa Solutions

Germany . 2,581 parts In-Stock

1+ parts

$19.763

100+ parts

$16.206

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2,581

$19.763

$16.206

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$19.763

100+ parts

$18.775

1k+ parts

$17.787

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1,881

$19.763

$18.775

$17.787

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One Stop Electronics

USA . 863 parts In-Stock

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$63.000

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863

$63.000

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Corphita

USA . 2,976 parts In-Stock

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2,976

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Overview

Unlock the power of precision with the SN74L123J by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The SN74L123J falls under the Prescaler & Multivibrators category, offering versatile applications for various electronic projects. Customers can trust in the value and benefits that this product brings, from its durable ceramic package body to its commercial-grade temperature grade. Experience the advantages of Texas Instruments technology with the SN74L123J, designed to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer better thermal conductivity and can tolerate higher temperatures, making this product suitable for high-performance applications.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and efficient design, allowing for easier integration into electronic circuits.

No. of Terminals: 16

Having 16 terminals allows for more connections and flexibility in circuit design, making this product versatile for different applications.

Package Style (Meter): IN-LINE

In-line package style is commonly used and compatible with various circuit boards, making it easy to incorporate this product into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand higher temperatures without compromising its performance, ensuring stability in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0 °C ensures that this product can function reliably in a wide range of conditions, making it suitable for diverse applications.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves reliability in connections, reducing the risk of signal loss or malfunction in the circuit.

Temperature Grade: COMMERCIAL

Commercial temperature grade means this product is suitable for standard commercial applications, offering a balance between performance and cost-effectiveness.

Technology: TTL

TTL technology provides fast switching speeds and low power consumption, making this product efficient and suitable for high-speed digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers secure connections and easy soldering, ensuring a reliable and durable connection in the circuit.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product is compatible with standard PCB layouts, allowing for easy integration and assembly in electronic systems.

Technical Specifications

Prescaler & Multivibrators SN74L123J attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74L123J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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