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DS8628N-3

Texas Instruments

DS8628N-3 by Texas Instruments

DS8628N-3 by Texas Instruments is a Prescaler & Multivibrator with 8 terminals, operating at 5V. It has a max frequency of 130MHz and operates in temperatures ranging from -30°C to 70°C. Ideal for applications requiring ECL technology and open-collector output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,095 parts In-Stock

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Anansix

USA . 1,621 parts In-Stock

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Digiode

USA . 1,385 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 281 parts In-Stock

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$11.705

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$12.093

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281

$11.705

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$12.093

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DigiPath Technology Company

USA . 1,216 parts In-Stock

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$12.889

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$11.858

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AZTECH Wire

Italy . 266 parts In-Stock

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$13.088

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266

$13.088

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ChromeModa Solutions

Germany . 4,941 parts In-Stock

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$13.152

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$10.785

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4,941

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$10.785

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IDEA Electronic Components Group

UK . 1,405 parts In-Stock

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$13.152

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$12.494

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$11.837

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1,405

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$11.837

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One Stop Electronics

USA . 126 parts In-Stock

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$42.000

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Northwest PG Solutions

USA . 942 parts In-Stock

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Corphita

USA . 723 parts In-Stock

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Native Components

USA . 652 parts In-Stock

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Overview

Unlock the power of precision with the DS8628N-3 by Texas Instruments. Crafted with superior quality and expertise, this Prescaler & Multivibrator is designed to elevate your projects to new heights. Whether you're in the aerospace industry or working on cutting-edge telecommunications solutions, this versatile component offers unmatched reliability and performance. Experience seamless integration, enhanced functionality, and unparalleled value with the DS8628N-3. Choose Texas Instruments for excellence that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat, making the product reliable for long-term use.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without performance degradation.

Maximum Frequency At Nominal Supply: 130000000 Hz

The high maximum frequency allows for efficient and fast signal processing, making it suitable for high-speed applications.

Technology: ECL

ECL technology provides high speed and low power consumption, making it a reliable choice for demanding applications.

Technical Specifications

Prescaler & Multivibrators DS8628N-3 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Family:

DS86

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.817 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

130000000 Hz

No. of Data/Clock Inputs:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Minimum fmax:

20 MHz

Trade Compliance

DS8628N-3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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