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SN75LVDS88APFDR

Texas Instruments

SN75LVDS88APFDR by Texas Instruments

SN75LVDS88APFDR by Texas Instruments is a CMOS microprocessor circuit with 100 terminals in a square package. It operates at a nominal voltage of 3.3V and has a max supply voltage of 3.6V, making it suitable for various applications requiring high-speed data transmission and low power consumption. This IC is commonly used in flatpack, heat sink/slug, thin profile configurations for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,403 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,403

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Digiode

USA . 4,913 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,913

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,301 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

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10k+ parts

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1,301

$7.000

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AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$11.176

100+ parts

-

1k+ parts

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10k+ parts

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888

$11.176

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Parana Technologies

USA . 171 parts In-Stock

1+ parts

$26.768

100+ parts

-

1k+ parts

$28.369

10k+ parts

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171

$26.768

-

$28.369

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DigiPath Technology Company

USA . 1,319 parts In-Stock

1+ parts

$29.474

100+ parts

$27.117

1k+ parts

-

10k+ parts

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1,319

$29.474

$27.117

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ChromeModa Solutions

Germany . 5,900 parts In-Stock

1+ parts

$30.076

100+ parts

$24.662

1k+ parts

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10k+ parts

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5,900

$30.076

$24.662

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IDEA Electronic Components Group

UK . 80 parts In-Stock

1+ parts

$30.076

100+ parts

$28.572

1k+ parts

$27.068

10k+ parts

-

80

$30.076

$28.572

$27.068

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Corohmni

South Africa . 380 parts In-Stock

1+ parts

$63.630

100+ parts

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10k+ parts

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380

$63.630

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Corphita

USA . 4,354 parts In-Stock

1+ parts

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4,354

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Overview

Elevate your electronic designs with the SN75LVDS88APFDR by Texas Instruments, a top-tier manufacturer known for their quality and innovation. This versatile peripheral IC is ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With a maximum supply voltage of 3.6V and a nominal supply voltage of 3.3V, this product offers superior performance and reliability. Its compact package style and terminal form make it easy to integrate into your projects, while its advanced CMOS technology ensures efficient operation. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation and protection for the components inside, increasing the durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient circuit board assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this product is suitable for a wide range of applications without the risk of damage from overvoltage.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, making it ideal for compact designs.

No. of Terminals: 100

Having 100 terminals provides flexibility in connecting various components and peripherals, making the product versatile for different applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The multiple package styles offer options for different design requirements, allowing for customization based on thermal management, space constraints, and assembly preferences.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources, making the product versatile for different power scenarios.

Terminal Position: QUAD

Quad terminal position provides stability and ease of soldering during the assembly process, improving manufacturability and reliability.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product is suitable for slim and compact designs, offering space-saving benefits.

Width: 14 mm

The 14 mm width offers a compact form factor, making the product ideal for applications where space is limited.

Length: 14 mm

The 14 mm length contributes to the compact size of the product, allowing for versatile placement on the circuit board.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit peripheral IC, this product offers advanced processing capabilities, making it suitable for complex applications that require high performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for various electronic devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, enhancing the durability and manufacturability of the product.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, the product is optimized for efficient operation within a specific voltage range, ensuring reliable performance.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density mounting on the circuit board, enabling compact designs and efficient use of PCB real estate.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN75LVDS88APFDR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SN75LVDS88APFDR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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