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SN75LVDS88APFD

Texas Instruments

SN75LVDS88APFD by Texas Instruments

SN75LVDS88APFD by Texas Instruments is a CMOS microprocessor circuit with 100 terminals in a square package. It operates b/w 0-70°C, with supply voltage range of 3-3.6V. This IC is commonly used in applications requiring high-speed data transmission and signal integrity, thanks to its gull wing terminal form and thin profile flatpack style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,989 parts In-Stock

1+ parts

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6,989

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Digiode

USA . 4,456 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,456

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$9.838

100+ parts

-

1k+ parts

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773

$9.838

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One Stop Electronics

USA . 1,310 parts In-Stock

1+ parts

$17.000

100+ parts

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1,310

$17.000

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Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

$55.760

100+ parts

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1,829

$55.760

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Corohmni

South Africa . 2,439 parts In-Stock

1+ parts

$61.799

100+ parts

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2,439

$61.799

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ChromeModa Solutions

Germany . 1,493 parts In-Stock

1+ parts

$62.652

100+ parts

$51.375

1k+ parts

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10k+ parts

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1,493

$62.652

$51.375

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IDEA Electronic Components Group

UK . 1,416 parts In-Stock

1+ parts

$62.652

100+ parts

$59.519

1k+ parts

$56.387

10k+ parts

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1,416

$62.652

$59.519

$56.387

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Corphita

USA . 3,345 parts In-Stock

1+ parts

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3,345

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DigiPath Technology Company

USA . 854 parts In-Stock

1+ parts

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100+ parts

$56.487

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854

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$56.487

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Overview

Discover the unmatched quality and reliability of the SN75LVDS88APFD by Texas Instruments, a leading manufacturer in the industry. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it perfect for a wide range of applications. With a maximum supply voltage of 3.6V and a minimum operating temperature of 0°C, this product offers exceptional value and benefits to customers looking for cutting-edge technology. Experience top-notch performance and seamless integration with the SN75LVDS88APFD, setting new standards in the field of microprocessor circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable saves space on the PCB and allows for automated assembly, increasing efficiency.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape is efficient for layout design and can help optimize space on the PCB.

No. of Terminals: 100

Having a high number of terminals allows for connectivity to various external components and peripherals, increasing versatility.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles offered provides options for different application requirements, ensuring compatibility with various design needs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate effectively even in colder environments.

Terminal Position: QUAD

The quad terminal position offers stable connectivity and ensures secure mounting on the PCB.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in keeping the overall profile of the product compact and slim.

Width: 14 mm

The moderate width allows for easy integration into standard PCB layouts without occupying excessive space.

Length: 14 mm

The moderate length of the product ensures compatibility with standard board sizes and facilitates easy placement.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, making it versatile for various industries.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit provides advanced processing capabilities and enhances the functionality of the product.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with a wide range of systems, making the product energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form ensures secure soldering connection and easy inspection during the manufacturing process.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic systems, ensuring compatibility with a wide range of applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and helps in optimizing the layout of the PCB for compact designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN75LVDS88APFD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SN75LVDS88APFD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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