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SN74SSTU32866GKER

Texas Instruments

SN74SSTU32866GKER by Texas Instruments

SN74SSTU32866GKER by Texas Instruments is a 25-bit TTL latch with 3ns propagation delay, suitable for commercial applications. Operating at 1.8V, it features positive edge trigger and true output polarity. With a compact grid array package style and low profile design, this flip-flop has a max frequency of 500MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,129 parts In-Stock

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Digiode

USA . 2,387 parts In-Stock

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LWI Electronics Inc

India . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 772 parts In-Stock

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$15.726

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$15.726

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Parana Technologies

USA . 1,341 parts In-Stock

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$17.608

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$17.800

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$17.608

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ChromeModa Solutions

Germany . 6,139 parts In-Stock

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$19.784

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$16.223

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$19.784

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IDEA Electronic Components Group

UK . 855 parts In-Stock

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$19.784

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$18.795

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$17.806

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855

$19.784

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$17.806

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One Stop Electronics

USA . 687 parts In-Stock

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$51.000

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Corphita

USA . 4,905 parts In-Stock

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Microchip USA

USA . 449 parts In-Stock

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DigiPath Technology Company

USA . 219 parts In-Stock

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$17.837

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Overview

Unleash the power of cutting-edge technology with the SN74SSTU32866GKER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality latches & flip-flops that guarantee high performance and reliability. Ideal for a wide range of applications, this product offers customers unparalleled value, benefits, and advantages. Experience seamless functionality and efficiency with the SN74SSTU32866GKER - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection to the internal components of the latch, ensuring long-term reliability.

No. of Bits: 25

With a high number of bits, this latch can handle complex data processing and storage requirements efficiently.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a standard supply voltage, making it compatible with a wide range of applications.

Propagation Delay (tpd): 3 ns

Low propagation delay ensures fast and efficient data transfer within the latch.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, making it suitable for various environmental conditions.

Technology: TTL

Utilizes TTL technology which is known for its reliability and compatibility with various digital systems.

Minimum fmax: 500 MHz

High maximum frequency allows for rapid processing of signals, making it ideal for applications requiring high-speed data transfer.

Technical Specifications

Latches & Flip-Flops SN74SSTU32866GKER attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

Length:

13.5 mm

Logic IC Type:

No. of Bits:

25

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

500 MHz

Trade Compliance

SN74SSTU32866GKER Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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