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SN74SSTU32864NMJR

Texas Instruments

SN74SSTU32864NMJR by Texas Instruments

SN74SSTU32864NMJR by Texas Instruments is a 25-bit bus driver with a propagation delay of 2.7 ns, suitable for commercial applications. It operates at a supply voltage range of 1.7V to 1.9V and has a max frequency of 500 MHz, making it ideal for high-speed data transmission in electronic systems. With surface mount capability and low profile design, this TTL technology-based transceiver offers efficient signal routing in compact spaces.

Median Price

$19.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,182 parts In-Stock

1+ parts

$13.370

100+ parts

$11.678

1k+ parts

$8.054

10k+ parts

-

4,182

$13.370

$11.678

$8.054

-

DigiKey

USA . 990 parts In-Stock

1+ parts

$19.650

100+ parts

$13.592

1k+ parts

$12.499

10k+ parts

-

990

$19.650

$13.592

$12.499

-

Mouser Electronics

USA . 945 parts In-Stock

1+ parts

$19.650

100+ parts

$13.600

1k+ parts

$12.490

10k+ parts

-

945

$19.650

$13.600

$12.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,589 parts In-Stock

1+ parts

$12.702

100+ parts

-

1k+ parts

-

10k+ parts

-

4,589

$12.702

-

-

-

Vyrian

USA . 6,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,169

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,878 parts In-Stock

1+ parts

$4.523

100+ parts

-

1k+ parts

$4.342

10k+ parts

$4.342

1,878

$4.523

-

$4.342

$4.342

Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$9.796

100+ parts

-

1k+ parts

$10.368

10k+ parts

-

1,836

$9.796

-

$10.368

-

DigiPath Technology Company

USA . 449 parts In-Stock

1+ parts

$10.787

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$10.787

-

-

-

ChromeModa Solutions

Germany . 3,285 parts In-Stock

1+ parts

$11.007

100+ parts

$9.026

1k+ parts

-

10k+ parts

-

3,285

$11.007

$9.026

-

-

IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$11.007

100+ parts

$10.457

1k+ parts

$9.906

10k+ parts

-

822

$11.007

$10.457

$9.906

-

Corphita

USA . 3,816 parts In-Stock

1+ parts

$12.033

100+ parts

-

1k+ parts

-

10k+ parts

-

3,816

$12.033

-

-

-

Overview

Enhance your electronic designs with the SN74SSTU32864NMJR by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This bus driver & transceiver offers fast propagation delay, low profile package style, and true output polarity, making it ideal for a wide range of applications. From industrial automation to telecommunications, this product delivers exceptional value and performance, ensuring seamless operation and efficiency in your projects. Elevate your designs with Texas Instruments and experience unmatched benefits and advantages that will take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The package material is durable and can protect the internal components of the bus driver & transceiver from external elements, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 2.7 ns

The fast propagation delay ensures quick data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement allows for energy-efficient operation and compatibility with a wide range of systems.

Maximum I (ol): 8 Amp

The high maximum output current capability enables this bus driver & transceiver to drive heavy loads without external amplification.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control, especially useful in synchronous communication protocols.

Minimum fmax: 500 MHz

The high maximum frequency capability makes this product suitable for high-speed data transmission applications that require fast signal processing.

Technical Specifications

Bus Driver & Transceivers SN74SSTU32864NMJR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Count Direction:

UNIDIRECTIONAL

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

25

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

2.7 ns

Propagation Delay (tpd):

2.7 ns

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

500 MHz

Trade Compliance

SN74SSTU32864NMJR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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