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SN74LVTH574PWE4

Texas Instruments

SN74LVTH574PWE4 by Texas Instruments

SN74LVTH574PWE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns at 3.3V, suitable for industrial applications. It features a max frequency of 150MHz, operates b/w -40 to 85°C, and has a low power supply current of 5mA. This BICMOS technology transceiver has dual terminals in a small outline package ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,836 parts In-Stock

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Digiode

USA . 2,764 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 744 parts In-Stock

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$8.000

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744

$8.000

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AZTECH Wire

Italy . 248 parts In-Stock

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$10.920

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248

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Parana Technologies

USA . 1,021 parts In-Stock

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$14.399

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$14.840

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$14.399

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DigiPath Technology Company

USA . 859 parts In-Stock

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$15.855

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$14.587

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859

$15.855

$14.587

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ChromeModa Solutions

Germany . 1,262 parts In-Stock

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$16.179

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$13.267

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1,262

$16.179

$13.267

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IDEA Electronic Components Group

UK . 669 parts In-Stock

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$16.179

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$15.370

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$14.561

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669

$16.179

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$14.561

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Andel Nordic

Denmark . 2,111 parts In-Stock

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$69.723

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$66.934

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$66.934

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$66.934

Component Stockers USA

USA . 734 parts In-Stock

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$99.990

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$99.990

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Microchip USA

USA . 2,459 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Experience top-notch quality and reliability with the SN74LVTH574PWE4 by Texas Instruments, a leading manufacturer in the industry. Perfect for Bus Driver & Transceiver applications, this product offers unmatched value with its 3-STATE output characteristics, true output polarity, and positive edge trigger type. With a fast propagation delay of only 4.5 ns and a maximum frequency of 150MHz, this small outline, thin profile package is ideal for industrial use. Trust Texas Instruments for innovative technology that delivers exceptional performance and efficiency to meet all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver and transceiver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication systems.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard nominal supply voltage of 3.3V, making it compatible with a wide range of electronic devices and systems.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options and compatibility with different circuit configurations.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures of up to 85°C, ensuring reliability in various environmental conditions.

Technology: BICMOS

Utilizing Bipolar CMOS technology combines the advantages of both technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74LVTH574PWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74LVTH574PWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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