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SN74LVTH32245ZKER

Texas Instruments

SN74LVTH32245ZKER by Texas Instruments

Texas Instruments SN74LVTH32245ZKER is an 8-bit bus driver with 3.7ns propagation delay at 3.3V, featuring a low-profile grid array package for industrial applications. It offers 4 functions, 2 ports, and operates b/w -40 to 85°C with a max supply voltage of 3.6V and common control interface.

Median Price

$543.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 381 parts In-Stock

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$543.000

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$302.000

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381

$543.000

$302.000

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Distributors (In-Stock)

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Mobius Materials

USA . 1,000 parts In-Stock

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$5.280

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$4.190

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$5.280

$4.190

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Chip Stock

USA . 3,800 parts In-Stock

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3,800

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Vyrian

USA . 2,505 parts In-Stock

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Digiode

USA . 1,794 parts In-Stock

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Bristol Electronics

USA . 1,258 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 345 parts In-Stock

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$6.090

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345

$6.090

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One Stop Electronics

USA . 1,199 parts In-Stock

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$20.000

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Parana Technologies

USA . 2,005 parts In-Stock

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$26.394

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$26.985

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2,005

$26.394

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$26.985

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DigiPath Technology Company

USA . 663 parts In-Stock

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$29.063

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663

$29.063

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ChromeModa Solutions

Germany . 5,964 parts In-Stock

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$29.656

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$24.318

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5,964

$29.656

$24.318

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IDEA Electronic Components Group

UK . 944 parts In-Stock

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$29.656

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$28.173

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$26.690

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944

$29.656

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$26.690

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Lixinc

USA . 19,721 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 447 parts In-Stock

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Corphita

USA . 223 parts In-Stock

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Montclair Electronics, Inc.

USA . 1 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVTH32245ZKER by Texas Instruments, a premium Bus Driver & Transceiver that offers unmatched quality and reliability. Manufactured by industry giant Texas Instruments, this product ensures top-notch performance and durability. With its 3-STATE output characteristics, true polarity, and common control feature, this versatile component is ideal for a wide range of applications. From industrial automation to consumer electronics, the SN74LVTH32245ZKER delivers exceptional value and benefits to customers seeking high-speed data transmission and seamless connectivity. Elevate your projects with Texas Instruments' latest innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transceiver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 3.7 ns

Low propagation delay ensures fast signal transmission, making it suitable for high-speed communication applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

No. of Functions: 4

Offers versatility and flexibility in functionality, allowing for multiple tasks to be performed by the transceiver.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with a wide range of systems and devices.

Maximum I (ol): 64 Amp

High output current capability enables driving of heavy loads, making it suitable for demanding applications.

Output Characteristics: 3-STATE

3-state outputs provide additional flexibility in controlling the bus lines, allowing for tri-state logic implementation.

Temperature Grade: INDUSTRIAL

Designed to withstand a wide temperature range, making it suitable for industrial environments with varying temperature conditions.

Technology: BICMOS

Utilizes BiCMOS technology for a combination of high-speed CMOS and low-power bipolar transistors, offering a balance of performance and efficiency.

Technical Specifications

Bus Driver & Transceivers SN74LVTH32245ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVTH32245ZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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