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SN74LVTH2952DBRG4

Texas Instruments

SN74LVTH2952DBRG4 by Texas Instruments

SN74LVTH2952DBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.6 ns at 3.3V, suitable for industrial applications. It features a max I (ol) of 64A, operates b/w -40 to 85°C, and has a package style of small outline shrink pitch. This transceiver has independent control and positive edge trigger type for bidirectional communication in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,078 parts In-Stock

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Digiode

USA . 4,310 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 886 parts In-Stock

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$8.876

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$8.876

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Andel Nordic

Denmark . 2,738 parts In-Stock

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$11.037

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$10.595

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$10.595

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$10.595

One Stop Electronics

USA . 1,156 parts In-Stock

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$26.000

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Parana Technologies

USA . 1,749 parts In-Stock

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$28.654

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$50.095

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$28.654

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DigiPath Technology Company

USA . 521 parts In-Stock

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$31.552

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521

$31.552

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ChromeModa Solutions

Germany . 4,451 parts In-Stock

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$32.196

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$26.401

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IDEA Electronic Components Group

UK . 706 parts In-Stock

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$32.196

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$30.586

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$28.976

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706

$32.196

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Corphita

USA . 3,734 parts In-Stock

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Microchip USA

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Overview

Unlock the power of seamless data transmission with Texas Instruments' SN74LVTH2952DBRG4 Bus Driver & Transceivers. Designed for industrial-grade applications, this high-quality product offers customers reliable performance and efficient signal propagation. With a compact package style and wide operating temperature range, this bus driver is perfect for a variety of electronic systems. Experience the advantage of true output polarity and independent control, providing flexibility and precision in your designs. Trust Texas Instruments to deliver cutting-edge technology that enhances your projects.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply : 4.6 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount : YES

Surface mount capability allows for easy and compact PCB assembly, saving space and simplifying the manufacturing process.

No. of Bits : 8

8-bit resolution provides a sufficient range of data transmission, suitable for various communication protocols and applications.

Nominal Supply Voltage / Vsup (V) : 3.3

Operates at a standard 3.3V supply voltage, ensuring compatibility with a wide range of systems and devices.

Power Supplies (V) : 3.3

Consistent power supply voltage of 3.3V ensures stable and reliable operation of the product.

No. of Terminals : 24

Ample number of terminals allow for versatile connectivity options and integration into complex circuits or systems.

Output Characteristics : 3-STATE

3-STATE output allows for tristate control, enabling efficient bus communications and reducing power consumption when in high-impedance state.

Minimum Operating Temperature : -40 °C

Wide operating temperature range of -40 to 85°C ensures reliable performance in extreme environmental conditions.

Maximum Supply Voltage (Vsup) : 3.6 V

Max supply voltage of 3.6V offers an additional safety margin and compatibility with higher voltage systems, enhancing flexibility in design and usage.

Technical Specifications

Bus Driver & Transceivers SN74LVTH2952DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G24

Length:

8.2 mm

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74LVTH2952DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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