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SN74LVTH245APWRE4

Texas Instruments

SN74LVTH245APWRE4 by Texas Instruments

SN74LVTH245APWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4ns at 3.3V, suitable for industrial applications. It features a 3-STATE output and operates within a temperature range of -40 to 85°C. With a small outline package style and dual terminal position, it offers bidirectional control in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 17,890 parts In-Stock

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Vyrian

USA . 2,316 parts In-Stock

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Digiode

USA . 653 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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One Stop Electronics

USA . 1,187 parts In-Stock

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$5.000

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$5.000

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AZTECH Wire

Italy . 434 parts In-Stock

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$10.299

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Corohmni

South Africa . 111 parts In-Stock

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$16.381

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Parana Technologies

USA . 1,177 parts In-Stock

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$28.129

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$44.029

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DigiPath Technology Company

USA . 1,158 parts In-Stock

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$30.974

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ChromeModa Solutions

Germany . 2,904 parts In-Stock

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$31.606

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$25.917

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IDEA Electronic Components Group

UK . 1,209 parts In-Stock

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$31.606

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$30.026

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$28.445

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Ampacity Inc.

Singapore . 1,001 parts In-Stock

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Andel Nordic

Denmark . 11 parts In-Stock

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$110.218

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11

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Continental Prestige Electronics

USA . 5,193 parts In-Stock

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Argo Parts USA

USA . 4,428 parts In-Stock

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Microchip USA

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Corphita

USA . 1,801 parts In-Stock

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Bastille Electronics

Australia . 76 parts In-Stock

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Overview

Unlock seamless data transmission with the SN74LVTH245APWRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in their products. The SN74LVTH245APWRE4 falls under the Bus Driver & Transceivers category, making it perfect for various applications. Experience lightning-fast propagation delay, 3-STATE output characteristics, and a compact design with this 8-bit wonder. Trust Texas Instruments to deliver exceptional performance and efficiency, providing you with unmatched value and benefits in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures consistent performance and compatibility with a wide range of systems.

Power Supplies (V): 3.3

Operating at 3.3V ensures low power consumption and efficient energy usage.

Output Characteristics: 3-STATE

3-state output allows for flexible control of signal lines, enabling tri-state bus control and efficient multi-device communication.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Maximum Operating Temperature: 85 °C

Operational temperature range up to 85°C ensures reliability in varying environmental conditions, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SN74LVTH245APWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74LVTH245APWRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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