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SN74LVTH16952DLG4

Texas Instruments

SN74LVTH16952DLG4 by Texas Instruments

SN74LVTH16952DLG4 by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 2 functions, and 3.3V nominal voltage. It features a propagation delay of 4ns, operates at temperatures from -40 to 85°C, and has a max power supply current of 5mA. Ideal for industrial applications requiring bidirectional control with independent control capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,399 parts In-Stock

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Digiode

USA . 4,546 parts In-Stock

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Euro-Tech

UK . 280 parts In-Stock

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280

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

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$5.659

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482

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Andel Nordic

Denmark . 2,844 parts In-Stock

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$8.746

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$8.397

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$8.397

2,844

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$8.397

One Stop Electronics

USA . 682 parts In-Stock

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$16.000

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682

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Parana Technologies

USA . 1,123 parts In-Stock

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$19.082

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$19.133

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$19.082

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ChromeModa Solutions

Germany . 1,890 parts In-Stock

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$21.440

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$17.581

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1,890

$21.440

$17.581

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

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$21.440

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$20.368

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$19.296

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Corphita

USA . 2,984 parts In-Stock

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Microchip USA

USA . 2,732 parts In-Stock

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DigiPath Technology Company

USA . 632 parts In-Stock

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$19.330

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Overview

Unlock seamless data transmission with the SN74LVTH16952DLG4 from Texas Instruments. Crafted with precision and expertise, this bus driver and transceiver offers unparalleled quality and reliability. Whether you're designing high-performance computing systems or industrial automation equipment, this product is designed to meet your needs. With a compact design and advanced features, it provides fast propagation delay, low power consumption, and 3-state output characteristics. Trust in Texas Instruments to deliver cutting-edge technology that empowers your projects to reach new heights of efficiency and excellence. Elevate your designs with the SN74LVTH16952DLG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures quick signal transmission, making the product suitable for high-speed data communication.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, simplifying the design and reducing overall cost.

Package Shape: RECTANGULAR

Rectangular package shape is standard and fits well in most electronic designs and setups.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V enables compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance helps in faster switching and reduced power consumption, making the product efficient and reliable.

Power Supplies (V): 3.3

Consistent power supply at 3.3V ensures stable performance and prevents damage from voltage fluctuations.

No. of Terminals: 56

Having a high number of terminals allows for more connectivity options and versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package size with shrink pitch design saves space on the PCB and simplifies the layout of the circuit.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16952DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74LVTH16952DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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