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SN74LVTH16543DLG4

Texas Instruments

SN74LVTH16543DLG4 by Texas Instruments

SN74LVTH16543DLG4 by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 3.2 ns propagation delay, and 3-STATE output characteristics. It operates at a nominal voltage of 3.3V and is ideal for bidirectional control applications in industrial settings due to its BICMOS technology and small outline package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,283 parts In-Stock

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Digiode

USA . 1,576 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Andel Nordic

Denmark . 332 parts In-Stock

1+ parts

$1.051

100+ parts

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$1.009

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$1.009

332

$1.051

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$1.009

$1.009

Parana Technologies

USA . 2,182 parts In-Stock

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$16.204

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$16.519

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AZTECH Wire

Italy . 780 parts In-Stock

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$16.804

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DigiPath Technology Company

USA . 623 parts In-Stock

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$17.843

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$16.415

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623

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$16.415

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One Stop Electronics

USA . 375 parts In-Stock

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$18.000

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$18.000

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ChromeModa Solutions

Germany . 593 parts In-Stock

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$18.207

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$14.930

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IDEA Electronic Components Group

UK . 466 parts In-Stock

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$18.207

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$17.297

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$16.386

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466

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$16.386

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Corphita

USA . 4,755 parts In-Stock

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Microchip USA

USA . 2,051 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVTH16543DLG4 by Texas Instruments. As a trusted manufacturer, Texas Instruments delivers top-quality Bus Driver & Transceivers for various applications. With fast propagation delay, 3-state output characteristics, and independent control features, this product offers exceptional value and performance. Whether you're working on industrial automation, telecommunications, or consumer electronics, the SN74LVTH16543DLG4 provides reliable connectivity and efficient signal transmission. Upgrade your projects today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 3.2 ns

Low propagation delay ensures fast and efficient signal transmission in the bus driver/transceiver.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and assembly time.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying the design and saving cost.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and fits well in standard circuit board layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used 3.3V supply voltage, compatible with many electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for stable and efficient operation of the bus driver/transceiver.

Power Supplies (V): 3.3

Consistent power supply voltage ensures reliable performance of the bus driver/transceiver.

No. of Terminals: 56

Sufficient number of terminals for connecting to other components and peripherals in the system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style with small outline and shrink pitch saves space on the circuit board.

Maximum I (ol): 64 Amp

High maximum output current capability allows the bus driver/transceiver to drive strong signals without distortion.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16543DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.2 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74LVTH16543DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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