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SN74LVTH16501DLR

Texas Instruments

SN74LVTH16501DLR by Texas Instruments

SN74LVTH16501DLR by Texas Instruments is an 18-bit bus driver with a propagation delay of 3.7 ns at 3.3V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and independent control for bidirectional communication in a small outline package.

Median Price

$1.837

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,698 parts In-Stock

1+ parts

$2.244

100+ parts

$1.854

1k+ parts

$1.002

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21,698

$2.244

$1.854

$1.002

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Rochester

USA . 160 parts In-Stock

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-

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$1.430

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$1.280

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$1.210

160

-

$1.430

$1.280

$1.210

Distributors (In-Stock)

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Digiode

USA . 2,872 parts In-Stock

1+ parts

$1.320

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2,872

$1.320

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Vyrian

USA . 4,193 parts In-Stock

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4,193

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Electronics Depot

USA . 961 parts In-Stock

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Bristol Electronics

USA . 746 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 58 parts In-Stock

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Lantek

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Distributors (Availability)

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Corphita

USA . 235 parts In-Stock

1+ parts

$1.251

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235

$1.251

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Component Stockers USA

USA . 230 parts In-Stock

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$1.430

100+ parts

$1.340

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230

$1.430

$1.340

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Andel Nordic

Denmark . 3,351 parts In-Stock

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$9.521

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$9.141

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$9.141

3,351

$9.521

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$9.141

$9.141

Parana Technologies

USA . 298 parts In-Stock

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$12.521

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$12.971

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298

$12.521

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$12.971

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AZTECH Wire

Italy . 888 parts In-Stock

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$13.250

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DigiPath Technology Company

USA . 2,196 parts In-Stock

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$13.788

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$13.788

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ChromeModa Solutions

Germany . 6,898 parts In-Stock

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$14.069

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$11.537

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$14.069

$11.537

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IDEA Electronic Components Group

UK . 2,027 parts In-Stock

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$14.069

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$13.366

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$12.662

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2,027

$14.069

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$12.662

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Assy Fe

Spain . 12,910 parts In-Stock

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Kepictronics

USA . 328 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unlock seamless data transmission and enhanced performance with the SN74LVTH16501DLR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This bus driver & transceiver offers unparalleled value with its fast propagation delay and 3-state output characteristics. Ideal for a wide range of applications, this product ensures smooth operation and efficiency. Experience the benefits of advanced technology and superior design with the SN74LVTH16501DLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the bus driver & transceiver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 3.7 ns

Fast propagation delay ensures quick response and efficient signal transmission within the bus driver & transceiver.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it easy to integrate into existing systems.

No. of Bits: 18

Provides a high level of data resolution and accuracy for communication in bus systems.

Maximum Operating Temperature: 85 °C

Suitable for use in a wide range of operating environments, including industrial settings where temperature variation is common.

Output Characteristics: 3-STATE

Allows the bus driver & transceiver to drive bus lines actively (high or low) or be in a high-impedance state, enhancing flexibility.

Trigger Type: POSITIVE EDGE

Ensures precise triggering of data transmission, improving the accuracy and reliability of communication.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16501DLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74LVTH16501DLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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