Loading...

SN74LVTH16374DGG

Texas Instruments

SN74LVTH16374DGG by Texas Instruments

SN74LVTH16374DGG by Texas Instruments is an 8-bit bus driver with 3-STATE output characteristics and a propagation delay of 5.2 ns. It operates at a nominal voltage of 3.3V, making it suitable for industrial applications requiring fast signal transmission in compact spaces. With a small outline package style and dual terminal position, it is ideal for designs where space efficiency is crucial.

Median Price

$3.030

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,020

-

-

-

-

North Shore Components

USA . 1,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,917

-

-

-

-

Digiode

USA . 292 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

292

-

-

-

-

TME

Poland . 280 parts In-Stock

1+ parts

-

100+ parts

$3.030

1k+ parts

$3.030

10k+ parts

-

280

-

$3.030

$3.030

-

Bristol Electronics

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$6.834

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$6.834

-

-

-

Parana Technologies

USA . 905 parts In-Stock

1+ parts

$23.017

100+ parts

-

1k+ parts

$23.662

10k+ parts

-

905

$23.017

-

$23.662

-

ChromeModa Solutions

Germany . 2,706 parts In-Stock

1+ parts

$25.862

100+ parts

$21.207

1k+ parts

-

10k+ parts

-

2,706

$25.862

$21.207

-

-

IDEA Electronic Components Group

UK . 1,947 parts In-Stock

1+ parts

$25.862

100+ parts

$24.569

1k+ parts

$23.276

10k+ parts

-

1,947

$25.862

$24.569

$23.276

-

One Stop Electronics

USA . 1,284 parts In-Stock

1+ parts

$51.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

$51.000

-

-

-

Andel Nordic

Denmark . 403 parts In-Stock

1+ parts

$590.972

100+ parts

-

1k+ parts

$567.333

10k+ parts

$567.333

403

$590.972

-

$567.333

$567.333

Corphita

USA . 3,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,049

-

-

-

-

Microchip USA

USA . 1,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,363

-

-

-

-

DigiPath Technology Company

USA . 437 parts In-Stock

1+ parts

-

100+ parts

$23.317

1k+ parts

-

10k+ parts

-

437

-

$23.317

-

-

ChipTracer

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Overview

Experience top-notch performance and reliability with the Texas Instruments SN74LVTH16374DGG bus driver & transceiver. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge technology that guarantees seamless data transmission in a variety of applications. Whether you're working on industrial automation or telecommunications systems, this product offers unmatched value with its fast propagation delay and low power consumption, making it the ideal choice for your next project. Trust in Texas Instruments to provide you with the best solutions for your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction, making it suitable for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in a single component adds versatility and functionality to the product, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor that can easily fit into various electronic devices and systems.

No. of Bits: 8

The 8-bit capacity allows for efficient data transmission and processing, making the product suitable for handling moderate to complex communication tasks.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V offers compatibility with a wide range of electronic systems and ensures efficient power consumption.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable signal transmission, contributing to the overall performance of the product.

No. of Terminals: 48

Having a high number of terminals allows for multiple connections and interfaces, enhancing the versatility and connectivity of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design make the product compact and space-efficient, ideal for applications with limited board space.

Propagation Delay (tpd): 5.2 ns

The low propagation delay of 5.2 ns ensures fast and efficient data transmission, making the product suitable for high-speed communication applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions, ensuring reliable performance in various settings.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signals, enabling efficient data transmission and processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments, making the product versatile and suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold offers excellent conductivity, corrosion resistance, and durability, ensuring long-term reliability and performance of the product.

Terminal Position: DUAL

The dual terminal position allows for multiple connection options, providing flexibility in PCB layout and assembly, making the product versatile and easy to integrate.

No. of Ports: 2

Having two ports enables simultaneous connection and communication with multiple devices or systems, enhancing the product's connectivity and functionality.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm contributes to a compact and slim profile, making the product suitable for space-constrained applications.

Width: 6.1 mm

The moderate width of 6.1 mm ensures compatibility with standard PCB designs and allows for easy integration into electronic systems and devices.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and processing, enhancing the reliability and performance of the product.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V allows for efficient power consumption and compatibility with a wide range of electronic systems, making the product versatile and energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and effective soldering during assembly, contributing to the durability and reliability of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and assembly, ensuring long-term performance and durability of the product.

Length: 12.5 mm

The moderate length of 12.5 mm provides compatibility with standard PCB layouts and designs, allowing for easy integration and installation in electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions and industrial applications, making the product suitable for a wide range of industries and settings.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance, low power consumption, and versatility in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable signal transmission and enhancing the overall performance of the product.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density PCB layout and assembly, maximizing space efficiency and enabling compact designs in electronic systems.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V allows for compatibility with a wide range of electronic systems and power sources, ensuring versatile and reliable operation.

Maximum Power Supply Current (ICC): 5 mA

The low maximum power supply current of 5 mA ensures efficient power consumption and minimal heat generation, contributing to the energy efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16374DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN74LVTH16374DGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20