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SN74LVCZ32244AZKER

Texas Instruments

SN74LVCZ32244AZKER by Texas Instruments

SN74LVCZ32244AZKER by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.1 ns at 3.3V, suitable for industrial applications. It features a low profile grid array package with 96 terminals and operates b/w -40 to 85°C, making it ideal for high-speed data transmission in harsh environments.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,848 parts In-Stock

1+ parts

$2.550

100+ parts

$2.500

1k+ parts

$2.450

10k+ parts

-

1,848

$2.550

$2.500

$2.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,892

-

-

-

-

Digiode

USA . 3,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,879

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$6.738

100+ parts

-

1k+ parts

-

10k+ parts

-

752

$6.738

-

-

-

One Stop Electronics

USA . 1,507 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$12.000

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$22.538

100+ parts

$20.510

1k+ parts

$18.481

10k+ parts

-

5,000

$22.538

$20.510

$18.481

-

Parana Technologies

USA . 2,171 parts In-Stock

1+ parts

$24.289

100+ parts

-

1k+ parts

$24.951

10k+ parts

-

2,171

$24.289

-

$24.951

-

DigiPath Technology Company

USA . 1,974 parts In-Stock

1+ parts

$26.745

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

$26.745

-

-

-

ChromeModa Solutions

Germany . 4,696 parts In-Stock

1+ parts

$27.291

100+ parts

$22.379

1k+ parts

-

10k+ parts

-

4,696

$27.291

$22.379

-

-

IDEA Electronic Components Group

UK . 2,358 parts In-Stock

1+ parts

$27.291

100+ parts

$25.926

1k+ parts

$24.562

10k+ parts

-

2,358

$27.291

$25.926

$24.562

-

Microchip USA

USA . 394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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394

-

-

-

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Corphita

USA . 391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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391

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Overview

Elevate your electronic designs with the SN74LVCZ32244AZKER by Texas Instruments, a top-tier manufacturer known for its quality and reliability. As a premier Bus Driver & Transceiver in the industry, this product offers exceptional performance and versatility. Whether you're working on industrial automation or communication systems, this 8-function device delivers seamless connectivity and efficient data transmission. With a wide range of applications and cutting-edge technology, the SN74LVCZ32244AZKER guarantees value and innovation for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 4.1 ns

The low propagation delay at nominal supply ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount capability makes installation and integration of the product easy and convenient, saving time and effort during assembly.

No. of Functions: 8

With 8 functions, this product offers versatile performance and functionality, making it a versatile choice for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, making it easy to power and operate the product.

Technology: CMOS

The use of CMOS technology ensures low power consumption and reliable operation, making this product energy-efficient and cost-effective.

Technical Specifications

Bus Driver & Transceivers SN74LVCZ32244AZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.2 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVCZ32244AZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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