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SN74LVCZ16245ADL

Texas Instruments

SN74LVCZ16245ADL by Texas Instruments

SN74LVCZ16245ADL by Texas Instruments is a bus driver with 8 bits, 2 functions, and 3.3V nominal voltage. It features a propagation delay of 4ns, operates in industrial temperature range (-40 to 85°C), and has a max power supply current of 0.06mA. Ideal for bidirectional communication applications requiring fast signal transmission in compact designs.

Median Price

$1.976

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,225 parts In-Stock

1+ parts

$2.283

100+ parts

$2.000

1k+ parts

$1.130

10k+ parts

-

6,225

$2.283

$2.000

$1.130

-

Rochester

USA . 5,925 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.370

5,925

-

$1.620

$1.450

$1.370

DigiKey

USA . 5,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.140

10k+ parts

-

5,925

-

-

$2.140

-

Verical

USA . 5,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.813

10k+ parts

$1.712

5,825

-

-

$1.813

$1.712

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,345 parts In-Stock

1+ parts

$1.492

100+ parts

-

1k+ parts

-

10k+ parts

-

3,345

$1.492

-

-

-

DigiKey Marketplace

USA . 11,825 parts In-Stock

1+ parts

-

100+ parts

$1.630

1k+ parts

-

10k+ parts

-

11,825

-

$1.630

-

-

Vyrian

USA . 2,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,290

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,884 parts In-Stock

1+ parts

$1.413

100+ parts

-

1k+ parts

-

10k+ parts

-

2,884

$1.413

-

-

-

Parana Technologies

USA . 1,073 parts In-Stock

1+ parts

$8.423

100+ parts

-

1k+ parts

$9.061

10k+ parts

-

1,073

$8.423

-

$9.061

-

DigiPath Technology Company

USA . 1,540 parts In-Stock

1+ parts

$9.275

100+ parts

-

1k+ parts

-

10k+ parts

-

1,540

$9.275

-

-

-

ChromeModa Solutions

Germany . 6,601 parts In-Stock

1+ parts

$9.464

100+ parts

$7.760

1k+ parts

-

10k+ parts

-

6,601

$9.464

$7.760

-

-

IDEA Electronic Components Group

UK . 12 parts In-Stock

1+ parts

$9.464

100+ parts

$8.991

1k+ parts

$8.518

10k+ parts

-

12

$9.464

$8.991

$8.518

-

Microchip USA

USA . 1,497 parts In-Stock

1+ parts

$10.600

100+ parts

$10.530

1k+ parts

$10.500

10k+ parts

$10.460

1,497

$10.600

$10.530

$10.500

$10.460

Overview

Elevate your electronics projects with the SN74LVCZ16245ADL from Texas Instruments, a top-tier manufacturer known for superior quality and innovation. As part of the Bus Driver & Transceivers category, this product offers reliability and performance like no other. With its advanced technology and wide range of applications, customers can trust in the value and benefits it brings to their designs. Experience seamless connectivity and efficient data transfer with the SN74LVCZ16245ADL, setting a new standard in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various conditions.

Propagation Delay At Nominal Supply: 4 ns

The low propagation delay ensures quick transmission of signals, making this product efficient for high-speed data transfer.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic devices, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design and reduces the need for additional components, making it a cost-effective choice.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes this product compatible with a wide range of systems, ensuring seamless integration.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling the bus lines, enabling efficient data transmission and management.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVCZ16245ADL attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.06 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74LVCZ16245ADL Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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