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SN74LVCR2245APWE4

Texas Instruments

SN74LVCR2245APWE4 by Texas Instruments

SN74LVCR2245APWE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.3 ns and operates at a nominal voltage of 1.8V. It features a small outline package, suitable for automotive applications, with dual terminal position and common control functionality.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 776 parts In-Stock

1+ parts

$1.940

100+ parts

$0.908

1k+ parts

$0.692

10k+ parts

$0.557

776

$1.940

$0.908

$0.692

$0.557

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,239 parts In-Stock

1+ parts

$1.216

100+ parts

-

1k+ parts

-

10k+ parts

-

1,239

$1.216

-

-

-

Vyrian

USA . 8,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,605

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 62 parts In-Stock

1+ parts

$1.152

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$1.152

-

-

-

Andel Nordic

Denmark . 287 parts In-Stock

1+ parts

$8.166

100+ parts

-

1k+ parts

$7.839

10k+ parts

$7.839

287

$8.166

-

$7.839

$7.839

Parana Technologies

USA . 1,859 parts In-Stock

1+ parts

$29.901

100+ parts

-

1k+ parts

$64.494

10k+ parts

-

1,859

$29.901

-

$64.494

-

DigiPath Technology Company

USA . 1,341 parts In-Stock

1+ parts

$32.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,341

$32.925

-

-

-

ChromeModa Solutions

Germany . 6,757 parts In-Stock

1+ parts

$33.597

100+ parts

$27.550

1k+ parts

-

10k+ parts

-

6,757

$33.597

$27.550

-

-

IDEA Electronic Components Group

UK . 976 parts In-Stock

1+ parts

$33.597

100+ parts

$31.917

1k+ parts

$30.237

10k+ parts

-

976

$33.597

$31.917

$30.237

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Microchip USA

USA . 1,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,180

-

-

-

-

Overview

Unleash the power of seamless data transfer with the SN74LVCR2245APWE4 by Texas Instruments. Crafted with precision and excellence, this bus driver & transceiver offers unmatched reliability and performance in a compact package. Ideal for a wide range of applications, this versatile component ensures smooth communication between devices. Experience faster propagation delays and efficient power consumption, all backed by Texas Instruments' reputation for quality and innovation. Elevate your projects with the SN74LVCR2245APWE4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the bus driver & transceiver, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast signal transmission, making this bus driver & transceiver ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement makes this bus driver & transceiver energy-efficient and suitable for low-power applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor provides flexibility in controlling the output signal, allowing for efficient communication between different components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver & transceiver reliable and efficient in various operating conditions.

Technical Specifications

Bus Driver & Transceivers SN74LVCR2245APWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74LVCR2245APWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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