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SN74LVCR2245APW

Texas Instruments

SN74LVCR2245APW by Texas Instruments

SN74LVCR2245APW by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.3 ns at 1.8V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity is TRUE, and has a terminal pitch of 0.65 mm.

Median Price

$1.049

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,723 parts In-Stock

1+ parts

$0.958

100+ parts

$0.737

1k+ parts

$0.388

10k+ parts

-

35,723

$0.958

$0.737

$0.388

-

Mouser Electronics

USA . 1,290 parts In-Stock

1+ parts

$1.140

100+ parts

$0.643

1k+ parts

$0.614

10k+ parts

$0.537

1,290

$1.140

$0.643

$0.614

$0.537

DigiKey

USA . 352 parts In-Stock

1+ parts

$1.140

100+ parts

$0.680

1k+ parts

$0.590

10k+ parts

$0.538

352

$1.140

$0.680

$0.590

$0.538

Rochester

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$0.664

1k+ parts

$0.551

10k+ parts

$0.491

520

-

$0.664

$0.551

$0.491

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,026 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

-

10k+ parts

-

3,026

$0.512

-

-

-

Vyrian

USA . 7,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,090

-

-

-

-

LWI Electronics Inc

India . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,546 parts In-Stock

1+ parts

$0.485

100+ parts

-

1k+ parts

-

10k+ parts

-

3,546

$0.485

-

-

-

Andel Nordic

Denmark . 2,686 parts In-Stock

1+ parts

$5.611

100+ parts

-

1k+ parts

$5.387

10k+ parts

$5.387

2,686

$5.611

-

$5.387

$5.387

Parana Technologies

USA . 1,183 parts In-Stock

1+ parts

$25.995

100+ parts

-

1k+ parts

$26.585

10k+ parts

-

1,183

$25.995

-

$26.585

-

DigiPath Technology Company

USA . 340 parts In-Stock

1+ parts

$28.624

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$28.624

-

-

-

IDEA Electronic Components Group

UK . 2,066 parts In-Stock

1+ parts

$29.208

100+ parts

$27.748

1k+ parts

$26.287

10k+ parts

-

2,066

$29.208

$27.748

$26.287

-

ChromeModa Solutions

Germany . 21 parts In-Stock

1+ parts

$29.208

100+ parts

$23.951

1k+ parts

-

10k+ parts

-

21

$29.208

$23.951

-

-

Perfect Parts

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,645

-

-

-

-

Overview

Experience superior quality and reliability with the SN74LVCR2245APW by Texas Instruments, a leading manufacturer in the industry. This bus driver & transceiver is perfect for various applications, offering fast propagation delay and 3-state output characteristics. With a compact package design and low power consumption, this product provides exceptional value and performance to customers. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast signal transmission and efficient performance of the bus driver & transceiver.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, making it a convenient choice for compact designs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V can contribute to energy efficiency and compatibility with low-power systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this bus driver & transceiver can withstand elevated temperatures, making it suitable for automotive applications.

Technical Specifications

Bus Driver & Transceivers SN74LVCR2245APW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74LVCR2245APW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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