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SN74LVCH16374AZRDR

Texas Instruments

SN74LVCH16374AZRDR by Texas Instruments

SN74LVCH16374AZRDR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns and operates at a max frequency of 150MHz. It features a 3-STATE output, suitable for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,679 parts In-Stock

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5,679

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Digiode

USA . 1,401 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 436 parts In-Stock

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$16.840

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436

$16.840

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Parana Technologies

USA . 396 parts In-Stock

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$22.717

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$23.381

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396

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DigiPath Technology Company

USA . 1,837 parts In-Stock

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$25.014

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$25.014

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ChromeModa Solutions

Germany . 5,601 parts In-Stock

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$25.525

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$20.930

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5,601

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

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$25.525

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$24.249

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$22.972

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1,576

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$22.972

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One Stop Electronics

USA . 1,168 parts In-Stock

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$61.000

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Andel Nordic

Denmark . 51 parts In-Stock

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$84.310

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$80.937

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$80.937

51

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$80.937

Corphita

USA . 3,872 parts In-Stock

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Microchip USA

USA . 160 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LVCH16374AZRDR from Texas Instruments, a top-tier manufacturer known for producing high-quality Bus Driver & Transceivers. This versatile component offers reliable 3-STATE output characteristics, fast propagation delay, and a wide range of applications. With its compact package body material and advanced technology, this product is designed to exceed expectations in industrial settings. Trust Texas Instruments for cutting-edge solutions that deliver exceptional performance and value. Upgrade your designs today with the SN74LVCH16374AZRDR!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable and long-lasting applications.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast and efficient signal transmission, making it suitable for high-speed data communication.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

The inclusion of multiple functions in one component enhances the product's versatility and functionality, making it cost-effective and space-efficient.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement helps in reducing power consumption and heat dissipation, making it energy-efficient and suitable for battery-operated devices.

Output Characteristics: 3-STATE

The 3-STATE output allows the driver to control the bus lines effectively by providing three different logic levels (high, low, and high-impedance), enabling efficient data transmission and bus management.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures that the product can operate reliably in harsh environments with high temperature fluctuations, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16374AZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B54

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Trade Compliance

SN74LVCH16374AZRDR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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