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SN74LVC821ANSRE4

Texas Instruments

SN74LVC821ANSRE4 by Texas Instruments

SN74LVC821ANSRE4 by Texas Instruments is a 10-bit bus driver with 3-STATE output, featuring a propagation delay of 7.3 ns at 1.8V supply voltage. It operates in industrial temperature range (-40 to 85°C) and supports a max frequency of 150MHz, making it ideal for high-speed data transmission applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,743 parts In-Stock

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Digiode

USA . 296 parts In-Stock

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296

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Distributors (Availability)

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Andel Nordic

Denmark . 3,165 parts In-Stock

1+ parts

$6.713

100+ parts

-

1k+ parts

$6.444

10k+ parts

$6.444

3,165

$6.713

-

$6.444

$6.444

AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$6.996

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$6.996

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One Stop Electronics

USA . 193 parts In-Stock

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$21.000

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193

$21.000

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Parana Technologies

USA . 1,356 parts In-Stock

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$24.867

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$25.554

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1,356

$24.867

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$25.554

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IDEA Electronic Components Group

UK . 1,831 parts In-Stock

1+ parts

$27.940

100+ parts

$26.543

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$25.146

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1,831

$27.940

$26.543

$25.146

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ChromeModa Solutions

Germany . 1,017 parts In-Stock

1+ parts

$27.940

100+ parts

$22.911

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1,017

$27.940

$22.911

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Component Stockers USA

USA . 350 parts In-Stock

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$99.990

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350

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Corphita

USA . 4,650 parts In-Stock

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4,650

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DigiPath Technology Company

USA . 2,052 parts In-Stock

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$25.191

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2,052

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$25.191

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Microchip USA

USA . 177 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC821ANSRE4 by Texas Instruments, a top-quality bus driver & transceiver that promises reliable performance and seamless communication. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled value and benefits to customers. Perfect for a wide range of applications, this small outline package with 10 bits and a 3-state output polarity ensures optimal functionality. Upgrade your projects with the SN74LVC821ANSRE4 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, ensuring the product is long-lasting and easy to handle.

Propagation Delay At Nominal Supply: 7.3 ns

Fast propagation delay ensures quick response times, making this product suitable for high-speed data transmission.

Surface Mount: YES

Easily mountable on a surface, simplifying the installation process of the product.

Package Shape: RECTANGULAR

Compact and space-saving package shape, ideal for applications with limited space constraints.

No. of Bits: 10

Provides a higher resolution for data transmission, allowing for more precise control and communication.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption with a nominal supply voltage, making the product energy-efficient.

Load Capacitance (CL): 50 pF

Suitable for driving a standard load capacitance, ensuring compatibility with a wide range of devices.

Power Supplies (V): 3.3

Compatible with common power supplies, simplifying integration into existing systems.

No. of Terminals: 24

Sufficient terminals for connecting to multiple devices, enhancing versatility and connectivity options.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and allows for efficient PCB layout designs.

Maximum I (ol): 24 Amp

High output current capability allows driving of substantial loads, making the product versatile and reliable.

Propagation Delay (tpd): 8.5 ns

Fast propagation delay ensures minimal signal delay, improving overall system performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications, ensuring reliable operation in various environments.

Output Characteristics: 3-STATE

3-state output allows for flexibility in controlling the output signal, making the product adaptable to different scenarios.

Trigger Type: POSITIVE EDGE

Positive edge trigger type for precise signal control and synchronization, enabling accurate data transmission.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in harsh environments, ensuring the product's reliability in extreme conditions.

Terminal Position: DUAL

Dual terminal position for enhanced connection options, providing flexibility in installation and wiring configurations.

No. of Ports: 2

Two ports for increased connectivity and data transmission capabilities, allowing for versatile system integration.

Maximum Seated Height: 2 mm

Low seated height for compact design and efficient use of space in the system.

Width: 5.3 mm

Narrow width for space-efficient PCB layout and integration into tight spaces.

Output Polarity: TRUE

True output polarity for accurate signal representation, ensuring reliable communication between devices.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement for efficient power usage and compatibility with various power sources.

Length: 15 mm

Compact length for space-saving installation and integration into different systems and applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications for reliable operation in tough industrial environments.

Maximum Frequency At Nominal Supply: 150000000 Hz

High maximum frequency capability for fast data transmission and efficient communication between devices.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form for ease of soldering and secure connection to the PCB, ensuring reliable performance.

Packing Method: TR

TR packing method for convenient packaging and handling of the product, making it suitable for mass production and shipping.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB designs and connectors, ensuring easy integration into existing systems.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage for robust operation and compatibility with various power sources, ensuring reliable performance.

Technical Specifications

Bus Driver & Transceivers SN74LVC821ANSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

Length:

15 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.3 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74LVC821ANSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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