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SN74LVC821ANSR

Texas Instruments

SN74LVC821ANSR by Texas Instruments

SN74LVC821ANSR by Texas Instruments is a 10-bit bus driver with 3-STATE output. It operates at a max frequency of 150MHz, has a propagation delay of 8.5ns, and supports a load capacitance of 50pF. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,314 parts In-Stock

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Digiode

USA . 2,279 parts In-Stock

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Andel Nordic

Denmark . 75 parts In-Stock

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$2.210

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$2.122

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$2.122

75

$2.210

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$2.122

$2.122

AZTECH Wire

Italy . 202 parts In-Stock

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$11.470

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Parana Technologies

USA . 1,144 parts In-Stock

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$18.138

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$1,684.407

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$16.324

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$1,684.407

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DigiPath Technology Company

USA . 482 parts In-Stock

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$19.972

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482

$19.972

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ChromeModa Solutions

Germany . 3,867 parts In-Stock

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$20.380

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$16.712

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3,867

$20.380

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IDEA Electronic Components Group

UK . 288 parts In-Stock

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$20.380

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$19.361

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$18.342

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288

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One Stop Electronics

USA . 1,194 parts In-Stock

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$49.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,013 parts In-Stock

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Corphita

USA . 4,507 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the SN74LVC821ANSR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This bus driver & transceiver is versatile in its applications, providing seamless data transmission for various systems. With a nominal supply voltage of 1.8V and a maximum operating temperature of 85°C, this product offers exceptional value and benefits to customers looking for efficient and high-quality solutions. Upgrade your projects with the SN74LVC821ANSR and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 7.3 ns

Ensures quick signal transmission and response times, making the product suitable for high-speed data communication.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and improving overall efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Works efficiently at a lower voltage, reducing power consumption and heat generation.

No. of Bits: 10

Provides a good range of data transmission capabilities, suitable for various applications.

Maximum Operating Temperature: 85 °C

Can operate effectively in industrial environments with high temperatures, ensuring reliability and performance.

Output Characteristics: 3-STATE

Allows the bus driver/transceiver to control the bus lines effectively by actively driving them, pulling them high or low, or allowing them to float to a high-impedance state.

Maximum Frequency At Nominal Supply: 150000000 Hz

Supports high-frequency operations, making it suitable for applications that require fast data transmission.

Technical Specifications

Bus Driver & Transceivers SN74LVC821ANSR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

Length:

15 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.3 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74LVC821ANSR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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