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SN74LVC574AQPWRQ1

Texas Instruments

SN74LVC574AQPWRQ1 by Texas Instruments

SN74LVC574AQPWRQ1 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7ns and operates at a supply voltage of 3.3V. It is designed for automotive applications, featuring a small outline package with dual terminals and Gull Wing form factor, suitable for high-frequency operations up to 150MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,679 parts In-Stock

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Digiode

USA . 202 parts In-Stock

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Andel Nordic

Denmark . 286 parts In-Stock

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$4.300

100+ parts

-

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$4.128

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$4.128

286

$4.300

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$4.128

$4.128

Parana Technologies

USA . 133 parts In-Stock

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$13.273

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$13.776

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DigiPath Technology Company

USA . 370 parts In-Stock

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$14.616

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$13.446

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370

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$13.446

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$14.914

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$14.168

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$13.423

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713

$14.914

$14.168

$13.423

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ChromeModa Solutions

Germany . 605 parts In-Stock

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$14.914

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$12.229

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605

$14.914

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AZTECH Wire

Italy . 803 parts In-Stock

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$15.830

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One Stop Electronics

USA . 1,263 parts In-Stock

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$31.000

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QUARKTWIN TECHNOLOGY LTD

USA . 18,139 parts In-Stock

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Microchip USA

USA . 5,699 parts In-Stock

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Corphita

USA . 4,810 parts In-Stock

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Overview

Enhance your automotive applications with the Texas Instruments SN74LVC574AQPWRQ1, a reliable and high-quality bus driver and transceiver. With a focus on durability and performance, Texas Instruments delivers cutting-edge technology to meet your needs. This versatile product, designed for the automotive industry, offers fast propagation delays and 3-state output characteristics, making it ideal for a wide range of applications. Trust in Texas Instruments for top-notch solutions that provide value, efficiency, and unmatched performance for all your design challenges.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures quick data transmission, making the product efficient and responsive.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and durability in automotive environments, making it a dependable choice.

No. of Bits: 8

8-bit resolution provides sufficient data handling capability, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low nominal supply voltage, helping to conserve power and improve energy efficiency.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable operation and reliable signal transmission.

Power Supplies (V): 3.3

Compatible with standard power supplies, making integration into existing systems convenient.

Terminal Position: DUAL

Dual terminal position allows for versatile connectivity options, enhancing flexibility in system design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC574AQPWRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74LVC574AQPWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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