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SN74LVC574ADWRE4

Texas Instruments

SN74LVC574ADWRE4 by Texas Instruments

SN74LVC574ADWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7 ns at 1.8V, suitable for automotive applications. It features a max frequency of 150MHz, operates at temperatures ranging from -40 to 125°C, and has a low power supply current of 0.01mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,995 parts In-Stock

1+ parts

-

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2,995

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Vyrian

USA . 2,462 parts In-Stock

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-

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-

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2,462

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$7.777

100+ parts

-

1k+ parts

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417

$7.777

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One Stop Electronics

USA . 765 parts In-Stock

1+ parts

$20.000

100+ parts

-

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765

$20.000

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Parana Technologies

USA . 717 parts In-Stock

1+ parts

$29.060

100+ parts

-

1k+ parts

$54.945

10k+ parts

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717

$29.060

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$54.945

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DigiPath Technology Company

USA . 1,889 parts In-Stock

1+ parts

$31.999

100+ parts

$29.439

1k+ parts

-

10k+ parts

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1,889

$31.999

$29.439

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

1+ parts

$32.652

100+ parts

$31.019

1k+ parts

$29.387

10k+ parts

-

1,632

$32.652

$31.019

$29.387

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ChromeModa Solutions

Germany . 697 parts In-Stock

1+ parts

$32.652

100+ parts

$26.775

1k+ parts

-

10k+ parts

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697

$32.652

$26.775

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Microchip USA

USA . 2,543 parts In-Stock

1+ parts

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2,543

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Corphita

USA . 458 parts In-Stock

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458

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Overview

Unlock seamless data transmission with the SN74LVC574ADWRE4 by Texas Instruments. Crafted with precision and reliability, this bus driver & transceiver is designed to elevate your electronic projects to new heights. From automotive applications to industrial automation, this versatile component offers a wide range of possibilities for your next innovation. Experience lightning-fast speed, low power consumption, and exceptional performance with the SN74LVC574ADWRE4. Trust in Texas Instruments for quality you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and able to withstand harsh conditions, making the product suitable for use in various environments.

Propagation Delay At Nominal Supply: 7 ns

With a low propagation delay, this product ensures fast and efficient transmission of data, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes this product easy to install and saves space on the PCB, enhancing overall design flexibility.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage makes this product energy-efficient and helps to reduce power consumption.

Output Characteristics: 3-STATE

The 3-state output allows the product to drive bus lines effectively, enabling the connection of multiple devices without interference.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product reliable and efficient in various applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC574ADWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

21.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74LVC574ADWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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