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SN74LVC540APWRG4

Texas Instruments

SN74LVC540APWRG4 by Texas Instruments

SN74LVC540APWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.3 ns, operating at a supply voltage of 1.8V. It features a max I (ol) of 24A and is suitable for automotive applications due to its temperature grade and thin profile package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 14,080 parts In-Stock

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Vyrian

USA . 5,381 parts In-Stock

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Digiode

USA . 2,143 parts In-Stock

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2,143

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EMSNET

USA . 1,550 parts In-Stock

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Euro-Tech

UK . 790 parts In-Stock

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790

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Ampacity Inc.

Singapore . 1,218 parts In-Stock

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$4.000

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1,218

$4.000

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Corohmni

South Africa . 12 parts In-Stock

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$8.469

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12

$8.469

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AZTECH Wire

Italy . 522 parts In-Stock

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$9.537

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$9.537

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Parana Technologies

USA . 483 parts In-Stock

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$14.978

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$15.404

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$14.978

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$15.404

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ChromeModa Solutions

Germany . 6,190 parts In-Stock

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$16.829

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$13.800

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$16.829

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IDEA Electronic Components Group

UK . 1,323 parts In-Stock

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$16.829

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$15.988

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$15.146

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$15.146

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Semicontronic

India . 1,447 parts In-Stock

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$27.000

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$26.325

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One Stop Electronics

USA . 911 parts In-Stock

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Continental Prestige Electronics

USA . 5,163 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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DigiPath Technology Company

USA . 1,192 parts In-Stock

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$15.173

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Microchip USA

USA . 1,008 parts In-Stock

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Corphita

USA . 929 parts In-Stock

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Argo Parts USA

USA . 612 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC540APWRG4 by Texas Instruments, a top-tier manufacturer known for high-quality components. This bus driver and transceiver offers reliable performance and versatile applications, making it a valuable asset for your projects. With a compact package design and low propagation delay, this product ensures efficient signal transmission. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your creations with the SN74LVC540APWRG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 5.3 ns

The low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product suitable for automotive and industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product reliable and efficient in various operating conditions.

Technical Specifications

Bus Driver & Transceivers SN74LVC540APWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.3 ns

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LVC540APWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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