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SN74LVC3G07YEAR

Texas Instruments

SN74LVC3G07YEAR by Texas Instruments

SN74LVC3G07YEAR by Texas Instruments is a logic gate with 3 functions, 3.7 ns propagation delay, and 50 pF load capacitance. It operates at a supply voltage of 1.8V and has open-drain output characteristics. Ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,443 parts In-Stock

1+ parts

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2,443

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Digiode

USA . 2,077 parts In-Stock

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2,077

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 761 parts In-Stock

1+ parts

$17.198

100+ parts

-

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761

$17.198

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Parana Technologies

USA . 2,218 parts In-Stock

1+ parts

$21.043

100+ parts

-

1k+ parts

$21.279

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2,218

$21.043

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$21.279

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DigiPath Technology Company

USA . 976 parts In-Stock

1+ parts

$23.171

100+ parts

$21.317

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-

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976

$23.171

$21.317

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ChromeModa Solutions

Germany . 3,275 parts In-Stock

1+ parts

$23.644

100+ parts

$19.388

1k+ parts

-

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3,275

$23.644

$19.388

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IDEA Electronic Components Group

UK . 1,794 parts In-Stock

1+ parts

$23.644

100+ parts

$22.462

1k+ parts

$21.280

10k+ parts

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1,794

$23.644

$22.462

$21.280

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One Stop Electronics

USA . 183 parts In-Stock

1+ parts

$62.000

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183

$62.000

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Corphita

USA . 4,060 parts In-Stock

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4,060

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Microchip USA

USA . 331 parts In-Stock

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331

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Overview

Experience unparalleled performance and reliability with the SN74LVC3G07YEAR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality logic gates that are essential for a wide range of applications. With a low propagation delay and open-drain output characteristics, this product ensures seamless operation in industrial settings. Whether you're designing consumer electronics or automotive systems, this versatile logic gate offers unmatched value and efficiency. Trust Texas Instruments to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 3.7 ns

Low propagation delay ensures fast operation of the logic gates.

Surface Mount YES

Surface mount technology allows for easy and efficient PCB assembly.

No. of Functions 3

Having multiple functions in a single package provides versatility in circuit design.

Nominal Supply Voltage / Vsup (V) 1.8

Operating at a low nominal supply voltage helps in reducing power consumption.

Load Capacitance (CL) 50 pF

Suitable load capacitance for efficient signal processing and transmission.

Output Characteristics OPEN-DRAIN

Open-drain outputs allow for easy interfacing with other devices and circuits.

Maximum Operating Temperature 85 °C

Wide operating temperature range suitable for industrial applications.

Minimum Operating Temperature -40 °C

Operational in extreme temperatures making it versatile for various environments.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates SN74LVC3G07YEAR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e0

Length:

1.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

.9 mm

Trade Compliance

SN74LVC3G07YEAR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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