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SN74LVC373AZQNR

Texas Instruments

SN74LVC373AZQNR by Texas Instruments

SN74LVC373AZQNR by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.8 ns at 1.8V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and a terminal pitch of 0.65mm in a rectangular package style.

Median Price

$0.427

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 279 parts In-Stock

1+ parts

-

100+ parts

$0.427

1k+ parts

$0.354

10k+ parts

$0.316

279

-

$0.427

$0.354

$0.316

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,545 parts In-Stock

1+ parts

$0.332

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-

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1,545

$0.332

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Vyrian

USA . 6,429 parts In-Stock

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6,429

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LWI Electronics Inc

India . 993 parts In-Stock

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993

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Next Level Components, LLC

USA . 936 parts In-Stock

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936

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Distributors (Availability)

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Corphita

USA . 561 parts In-Stock

1+ parts

$0.314

100+ parts

-

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561

$0.314

-

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Andel Nordic

Denmark . 3,147 parts In-Stock

1+ parts

$3.804

100+ parts

-

1k+ parts

$3.652

10k+ parts

$3.652

3,147

$3.804

-

$3.652

$3.652

AZTECH Wire

Italy . 586 parts In-Stock

1+ parts

$12.390

100+ parts

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586

$12.390

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Parana Technologies

USA . 1,021 parts In-Stock

1+ parts

$23.689

100+ parts

-

1k+ parts

$24.312

10k+ parts

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1,021

$23.689

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$24.312

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DigiPath Technology Company

USA . 66 parts In-Stock

1+ parts

$26.085

100+ parts

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66

$26.085

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ChromeModa Solutions

Germany . 5,537 parts In-Stock

1+ parts

$26.617

100+ parts

$21.826

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5,537

$26.617

$21.826

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IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$26.617

100+ parts

$25.286

1k+ parts

$23.955

10k+ parts

-

520

$26.617

$25.286

$23.955

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Perfect Parts

USA . 24,454 parts In-Stock

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24,454

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Kepictronics

USA . 346 parts In-Stock

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346

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Microchip USA

USA . 217 parts In-Stock

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217

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Overview

Enhance your electronic designs with the SN74LVC373AZQNR by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability. With a wide range of applications, from consumer electronics to industrial automation, this product delivers exceptional value and efficiency. Experience the benefits of seamless data transmission and low power consumption, making it an ideal choice for your next project. Trust Texas Instruments to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures quick and efficient signal transmission, improving overall performance.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for devices that require lower power consumption.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state, providing flexibility in controlling the flow of data.

Technology: CMOS

CMOS technology offers low power consumption and noise immunity, making the product more reliable and efficient.

Technical Specifications

Bus Driver & Transceivers SN74LVC373AZQNR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

8.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

SN74LVC373AZQNR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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