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SN74LVC373AGQNR

Texas Instruments

SN74LVC373AGQNR by Texas Instruments

SN74LVC373AGQNR by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.8 ns at 1.8V, suitable for industrial applications. It features a package style of GRID ARRAY, very thin profile, and fine pitch, with a terminal pitch of 0.65 mm and operates within a temperature range of -40 to 85°C.

Median Price

$0.358

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 61 parts In-Stock

1+ parts

-

100+ parts

$0.358

1k+ parts

$0.297

10k+ parts

$0.265

61

-

$0.358

$0.297

$0.265

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,447 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

-

1,447

$0.277

-

-

-

Vyrian

USA . 8,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,117

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 794 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

-

10k+ parts

-

794

$0.263

-

-

-

AZTECH Wire

Italy . 317 parts In-Stock

1+ parts

$12.450

100+ parts

-

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-

10k+ parts

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317

$12.450

-

-

-

Parana Technologies

USA . 1,970 parts In-Stock

1+ parts

$24.012

100+ parts

-

1k+ parts

$24.668

10k+ parts

-

1,970

$24.012

-

$24.668

-

DigiPath Technology Company

USA . 1,611 parts In-Stock

1+ parts

$26.440

100+ parts

$24.325

1k+ parts

-

10k+ parts

-

1,611

$26.440

$24.325

-

-

ChromeModa Solutions

Germany . 3,149 parts In-Stock

1+ parts

$26.980

100+ parts

$22.124

1k+ parts

-

10k+ parts

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3,149

$26.980

$22.124

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$26.980

100+ parts

$25.631

1k+ parts

$24.282

10k+ parts

-

1,476

$26.980

$25.631

$24.282

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Andel Nordic

Denmark . 1,826 parts In-Stock

1+ parts

$87.796

100+ parts

-

1k+ parts

$84.284

10k+ parts

$84.284

1,826

$87.796

-

$84.284

$84.284

QUARKTWIN TECHNOLOGY LTD

USA . 29,300 parts In-Stock

1+ parts

-

100+ parts

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29,300

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Microchip USA

USA . 7,626 parts In-Stock

1+ parts

-

100+ parts

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7,626

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Overview

Enhance your electronic designs with the SN74LVC373AGQNR by Texas Instruments, a high-quality bus driver and transceiver that offers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for applications requiring precise signal transmission and control. With its advanced technology and innovative design, this component provides customers with unmatched value, benefits, and advantages. Upgrade your projects today with the SN74LVC373AGQNR and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for transportation applications.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast and efficient communication between bus drivers and transceivers, resulting in improved overall system performance.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, ensuring compatibility with various board layouts and designs.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V results in energy-efficient operation, helping to reduce power consumption and overall system costs.

Load Capacitance (CL): 50 pF

The 50pF load capacitance ensures stable signal transmission and reception, minimizing signal distortion and improving data integrity.

No. of Bits: 8

Having 8 bits allows for handling a wide range of data and signals, making the product versatile and suitable for various communication protocols.

Power Supplies (V): 3.3

The use of a 3.3V power supply provides compatibility with standard voltage levels commonly used in electronic systems, simplifying integration and power management.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the product can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, enhancing the overall reliability and efficiency of the product.

Technical Specifications

Bus Driver & Transceivers SN74LVC373AGQNR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e0

Length:

4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

8.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

SN74LVC373AGQNR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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