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SN74LVC2G126YEPR

Texas Instruments

SN74LVC2G126YEPR by Texas Instruments

SN74LVC2G126YEPR by Texas Instruments is a Bus Driver & Transceiver with 4ns Propagation Delay, 9.8ns tpd, and 24A Max Iol. It operates at a supply voltage of 1.8V to 3.3V and is ideal for industrial applications requiring true output polarity control in compact designs with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,932 parts In-Stock

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8,932

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ComSIT Distribution GmbH

Germany . 758 parts In-Stock

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758

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Digiode

USA . 609 parts In-Stock

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609

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Distributors (Availability)

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One Stop Electronics

USA . 977 parts In-Stock

1+ parts

$6.000

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977

$6.000

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AZTECH Wire

Italy . 739 parts In-Stock

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$6.721

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739

$6.721

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Parana Technologies

USA . 112 parts In-Stock

1+ parts

$22.703

100+ parts

$2,108.319

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$20.433

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112

$22.703

$2,108.319

$20.433

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Andel Nordic

Denmark . 2,463 parts In-Stock

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$23.518

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$22.577

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$22.577

2,463

$23.518

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$22.577

$22.577

DigiPath Technology Company

USA . 152 parts In-Stock

1+ parts

$24.999

100+ parts

$22.999

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152

$24.999

$22.999

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ChromeModa Solutions

Germany . 4,481 parts In-Stock

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$25.509

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$20.917

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4,481

$25.509

$20.917

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

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$25.509

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$24.234

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$22.958

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2,274

$25.509

$24.234

$22.958

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Corphita

USA . 1,018 parts In-Stock

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Microchip USA

USA . 172 parts In-Stock

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172

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Overview

Unlock seamless communication and enhanced performance with the Texas Instruments SN74LVC2G126YEPR bus driver & transceiver. With a propagation delay of just 4 ns, this versatile product is designed to optimize data transmission in a wide range of applications. Trust in the quality and reliability of Texas Instruments as you experience the benefits of fast signal propagation, efficient power management, and robust output characteristics. Elevate your design with the SN74LVC2G126YEPR and discover unparalleled value and efficiency in every project.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast signal transmission, making this product suitable for applications that require quick response times.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in one component can reduce the overall component count in a design, leading to cost savings and simpler circuit layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, which can be advantageous for power efficiency and compatibility with low-power devices.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making this product suitable for industrial environments where temperature can vary significantly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G126YEPR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B8

Length:

1.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74LVC2G126YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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