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SN74LVC1T45TDCKRQ1

Texas Instruments

SN74LVC1T45TDCKRQ1 by Texas Instruments

Texas Instruments' SN74LVC1T45TDCKRQ1 is a 6-terminal bus driver with translation for 1.8/5V, operating at -40 to 105°C. It features a max I (ol) of 24A, propagation delay of 20.7ns, and output polarity as TRUE. Ideal for bidirectional applications in industrial settings due to its AEC-Q100 screening level and compact package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,783 parts In-Stock

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Digiode

USA . 614 parts In-Stock

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Next Level Components, LLC

USA . 100 parts In-Stock

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100

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Andel Nordic

Denmark . 430 parts In-Stock

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$3.652

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$3.506

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$3.506

430

$3.652

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$3.506

Parana Technologies

USA . 431 parts In-Stock

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$14.106

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$1,309.920

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$12.695

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431

$14.106

$1,309.920

$12.695

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DigiPath Technology Company

USA . 985 parts In-Stock

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$15.532

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$14.289

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985

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ChromeModa Solutions

Germany . 2,510 parts In-Stock

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$15.849

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$12.996

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2,510

$15.849

$12.996

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IDEA Electronic Components Group

UK . 1,870 parts In-Stock

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$15.849

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$15.057

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$14.264

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AZTECH Wire

Italy . 293 parts In-Stock

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$16.959

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One Stop Electronics

USA . 393 parts In-Stock

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$39.000

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Lixinc

USA . 12,556 parts In-Stock

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Corphita

USA . 4,235 parts In-Stock

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Microchip USA

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Overview

Unlock the power of seamless data transmission with the SN74LVC1T45TDCKRQ1 from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that are essential for various applications. With AEC-Q100 screening level and industrial-grade technology, this product ensures reliable performance even in harsh environments. Experience the benefits of true output polarity, common control, and bidirectional communication in a compact package. Trust Texas Instruments to provide unmatched value and innovation in every component. Elevate your projects with the SN74LVC1T45TDCKRQ1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliable performance, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability for automotive applications.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and heat dissipation.

Maximum I (ol): 24 Amp

High output current rating of 24 Amp allows for driving heavy loads without any issues.

Propagation Delay (tpd): 20.7 ns

Low propagation delay ensures fast data transmission and response times in bus communication systems.

Maximum Operating Temperature: 105 °C

High operating temperature range makes the product suitable for industrial applications in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers SN74LVC1T45TDCKRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

20.7 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5V&1.8/5V

Width:

1.25 mm

Trade Compliance

SN74LVC1T45TDCKRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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