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SN74LVC1G04DCKJ

Texas Instruments

SN74LVC1G04DCKJ by Texas Instruments

SN74LVC1G04DCKJ by Texas Instruments is a CMOS logic gate with 4.2 ns propagation delay at 3.3V, suitable for industrial applications. It features a small outline package with dual terminals and can operate b/w -40 to 85°C, making it ideal for high-speed circuit designs requiring low power consumption.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 291,400 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

Japan . 870 parts In-Stock

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AZTECH Wire

Italy . 600 parts In-Stock

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$15.673

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Parana Technologies

USA . 2,127 parts In-Stock

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$16.226

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$16.538

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DigiPath Technology Company

USA . 1,269 parts In-Stock

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$17.866

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ChromeModa Solutions

Germany . 5,745 parts In-Stock

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$18.231

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$14.949

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IDEA Electronic Components Group

UK . 632 parts In-Stock

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$18.231

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$17.319

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$16.408

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Corohmni

South Africa . 127 parts In-Stock

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$21.809

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One Stop Electronics

USA . 506 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Semicontronic

India . 387 parts In-Stock

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Ampacity Inc.

Singapore . 556 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Bastille Electronics

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Microchip USA

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Overview

Discover the innovative Texas Instruments SN74LVC1G04DCKJ Logic Gate, a high-quality product designed to deliver reliable performance in a variety of applications. With a compact design and fast propagation delay, this logic gate offers customers unmatched value and efficiency. Whether you're working on industrial automation or consumer electronics, trust Texas Instruments to provide top-of-the-line solutions that meet your needs. Upgrade your projects with the SN74LVC1G04DCKJ and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and lightweight housing for the logic gate, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 4.2 ns

The fast propagation delay allows for quick signal processing, making this logic gate ideal for high-speed applications.

Surface Mount: YES

The surface-mount capability offers easy installation and saves space on a circuit board, making this logic gate convenient for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on a circuit board, optimizing space utilization.

Nominal Supply Voltage / Vsup: 3.3V

The 3.3V nominal supply voltage is commonly used in many electronic systems, making this logic gate compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and consistent performance in various circuit configurations.

Power Supplies (V): 3.3V

The consistent 3.3V power supply ensures reliable operation of the logic gate in different settings.

No. of Terminals: 5

With 5 terminals, this logic gate offers multiple connection points for integrating into different circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package allow for space-saving on the circuit board, making it suitable for compact devices.

Maximum I (ol): 24 Amp

The maximum output current of 24 Amps provides high drive capability for powering other components in the circuit.

Propagation Delay (tpd): 7.5 ns

The propagation delay of 7.5 ns ensures efficient signal processing and quick response times, making this logic gate suitable for time-sensitive applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this logic gate can withstand high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows this logic gate to function reliably in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish ensures good conductivity and corrosion resistance, prolonging the lifespan of the logic gate.

Terminal Position: DUAL

The dual terminal position offers versatility in connection options, allowing for flexibility in circuit design.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm minimizes the profile of the logic gate, ideal for slim electronic devices.

Width: 1.25 mm

The narrow width of 1.25 mm allows for space-efficient placement of the logic gate on a circuit board.

Minimum Supply Voltage (Vsup): 1.65V

The minimum supply voltage of 1.65V ensures the logic gate can operate effectively even with low power input.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during installation.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees secure solder joints, enhancing the reliability of the connection.

Length: 2 mm

The compact length of 2 mm saves space on the circuit board, making this logic gate suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions, making this logic gate suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this logic gate offers low power consumption and high noise immunity, enhancing efficiency and reliability in operation.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable connections, ensuring stable operation of the logic gate in different setups.

Packing Method: TR

The tape and reel packing method provides easy handling and storage of the logic gates, streamlining the manufacturing process.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise alignment and connection of the logic gate in a circuit layout.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage of 5.5V gives the logic gate flexibility in power requirements, making it versatile for various applications.

Technical Specifications

Logic Gates SN74LVC1G04DCKJ attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G04DCKJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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