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SN74LVC16245AZRDR

Texas Instruments

SN74LVC16245AZRDR by Texas Instruments

SN74LVC16245AZRDR by Texas Instruments is a CMOS bus driver with 8 bits and 2 functions. It operates at a supply voltage of 1.8V to 3.6V, has a propagation delay of 4ns, and features a max I (ol) of 24Amp. This industrial-grade transceiver is ideal for bidirectional applications requiring fast signal transmission in compact spaces.

Median Price

$1.425

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,403 parts In-Stock

1+ parts

$0.880

100+ parts

$0.860

1k+ parts

$0.840

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17,403

$0.880

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DigiKey

USA . 3,491 parts In-Stock

1+ parts

$1.970

100+ parts

$1.424

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$1.170

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3,491

$1.970

$1.424

$1.170

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Vyrian

USA . 8,035 parts In-Stock

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Digiode

USA . 1,163 parts In-Stock

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1,163

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Chip Stock

USA . 903 parts In-Stock

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903

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Odintec Ltd.

Israel . 83 parts In-Stock

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Prism Electronics

USA . 28 parts In-Stock

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Classic Components Corporation

USA . 28 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 1,005 parts In-Stock

1+ parts

$5.033

100+ parts

-

1k+ parts

$4.831

10k+ parts

$4.831

1,005

$5.033

-

$4.831

$4.831

One Stop Electronics

USA . 759 parts In-Stock

1+ parts

$15.000

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759

$15.000

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Parana Technologies

USA . 1,435 parts In-Stock

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$15.521

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$15.895

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1,435

$15.521

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$15.895

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DigiPath Technology Company

USA . 2,343 parts In-Stock

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$17.090

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$15.723

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2,343

$17.090

$15.723

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ChromeModa Solutions

Germany . 6,450 parts In-Stock

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$17.439

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$14.300

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6,450

$17.439

$14.300

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

1+ parts

$17.439

100+ parts

$16.567

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$15.695

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1,303

$17.439

$16.567

$15.695

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AZTECH Wire

Italy . 570 parts In-Stock

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$17.491

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QUARKTWIN TECHNOLOGY LTD

USA . 25,613 parts In-Stock

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Corphita

USA . 845 parts In-Stock

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Microchip USA

USA . 164 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SN74LVC16245AZRDR by Texas Instruments, a leading manufacturer in the industry. This versatile bus driver and transceiver offers seamless connectivity for a wide range of applications, ensuring smooth data transmission and efficient operation. With its advanced technology and robust construction, this product delivers exceptional value and performance for customers looking for a dependable solution. Trust Texas Instruments to provide you with innovative products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ruggedness, making this product suitable for harsh environmental conditions.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and compact installation on circuit boards, saving space and facilitating mass production.

No. of Functions: 2

Having multiple functions in a single device improves efficiency and reduces the need for additional components, making this product cost-effective.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to handle, making it compatible with standard assembly processes.

No. of Bits: 8

8 bits provide sufficient data handling capacity, making this product suitable for various digital communication protocols and applications.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage minimizes power consumption and heat dissipation, increasing the overall efficiency of the product.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable and reliable operation of the device, enhancing its performance in communication systems.

Power Supplies (V): 3.3

Compatible with standard power supplies at 3.3V, making integration with existing systems seamless and convenient.

No. of Terminals: 54

Having multiple terminals allows for versatile connectivity options, enabling the device to interface with various external components.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch layout offers high density and connectivity options, enhancing the product's versatility.

Maximum I (ol): 24 Amp

High output current rating supports robust signal transmission capabilities, making this product suitable for demanding industrial applications.

Propagation Delay (tpd): 7.1 ns

Low propagation delay ensures quick response times, reducing latency in communication systems and improving overall performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C ensures reliability and stability in varying environmental conditions, making this product suitable for industrial use.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling bus sharing and bidirectional communication, enhancing flexibility in system design.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions down to -40°C without performance degradation, making this product suitable for harsh environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections over the product's lifespan.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making installation and maintenance of the product hassle-free.

No. of Ports: 2

Having multiple ports allows for versatile connectivity options, enabling the device to interface with multiple devices simultaneously.

Maximum Seated Height: 1.2 mm

Low seated height profile saves space and facilitates compact design, making this product suitable for applications where size constraints are a concern.

Width: 5.5 mm

Compact width dimension enables space-efficient integration on PCBs, allowing for compact system designs without compromising performance.

Output Polarity: TRUE

True output polarity simplifies signal interpretation and compatibility with other digital devices, enhancing overall system reliability and performance.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement allows for operation with lower power sources, increasing energy efficiency and extending battery life in portable applications.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures compatibility with lead-free soldering processes and industry standards, facilitating efficient production.

Length: 8 mm

Compact length dimension offers space-efficient integration on PCBs, allowing for streamlined system designs without compromising functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating environments, making this product suitable for industrial automation and control applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's energy efficiency and reliability in digital communication systems.

Terminal Form: BALL

Ball terminal form simplifies soldering and connection processes, ensuring secure and reliable connections during installation and maintenance.

Packing Method: TR

TR (tape and reel) packing method facilitates automated pick-and-place assembly processes, reducing production time and costs for high-volume manufacturing.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density interconnects, allowing for compact PCB layouts and efficient use of space in electronic designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile data transmission in both directions, supporting flexible communication protocols and system configurations.

Control Type: COMMON CONTROL

Common control interface simplifies system integration and operation, enabling seamless communication between different components and devices.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance of 3.6V ensures compatibility with standard power sources, offering flexibility in system design and integration.

Maximum Power Supply Current (ICC): 0.02 mA

Low maximum power supply current requirement of 0.02mA minimizes power consumption, making this product energy-efficient and cost-effective in operation.

Technical Specifications

Bus Driver & Transceivers SN74LVC16245AZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVC16245AZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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