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SN74LVC14ADBRG4

Texas Instruments

SN74LVC14ADBRG4 by Texas Instruments

SN74LVC14ADBRG4 by Texas Instruments is a CMOS logic gate with 6 functions, 8 ns propagation delay at 1.8V. It operates in automotive grade conditions (-40 to 125 °C) and has a small outline package style for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 15,500 parts In-Stock

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Vyrian

USA . 8,294 parts In-Stock

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Digiode

USA . 4,288 parts In-Stock

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4,288

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Sensible Micro Corp

USA . 255 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 488 parts In-Stock

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$10.222

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488

$10.222

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AZTECH Wire

Italy . 776 parts In-Stock

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$13.212

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776

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Semicontronic

India . 1,482 parts In-Stock

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$17.000

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$16.575

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$16.490

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Parana Technologies

USA . 2,342 parts In-Stock

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$21.461

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$21.834

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DigiPath Technology Company

USA . 742 parts In-Stock

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$23.632

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$21.741

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$23.935

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$22.738

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$22.738

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870

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ChromeModa Solutions

Germany . 3,508 parts In-Stock

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IDEA Electronic Components Group

UK . 1,747 parts In-Stock

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One Stop Electronics

USA . 1,590 parts In-Stock

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Ampacity Inc.

Singapore . 796 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Bastille Electronics

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Overview

Experience unprecedented quality and reliability with the SN74LVC14ADBRG4 by Texas Instruments, a leading manufacturer in the industry. This logic gate offers unmatched performance and efficiency, making it ideal for various applications. From automotive to industrial settings, this product ensures seamless operation and precise functionality. Trust Texas Instruments to deliver innovative solutions that exceed expectations and provide exceptional value to customers. Choose the SN74LVC14ADBRG4 for top-notch performance and reliability in all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and heat dissipation, making this product energy-efficient.

No. of Terminals: 14

With a higher number of terminals, this product offers more connection options and flexibility in circuit design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in extreme environmental conditions.

Schmitt Trigger: YES

Schmitt trigger input ensures hysteresis and noise immunity, improving the overall reliability and stability of the output signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Logic Gates SN74LVC14ADBRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74LVC14ADBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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