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SN74LVC126ADE4

Texas Instruments

SN74LVC126ADE4 by Texas Instruments

SN74LVC126ADE4 by Texas Instruments is a 4-function bus driver with 6ns propagation delay at 1.8V, suitable for automotive applications. It features a 3-STATE output, operates b/w -40 to 125°C, and has a max supply voltage of 3.6V. With a small outline package style and dual terminal position, it offers efficient signal transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,078 parts In-Stock

1+ parts

-

100+ parts

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6,078

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Digiode

USA . 2,778 parts In-Stock

1+ parts

-

100+ parts

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2,778

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 327 parts In-Stock

1+ parts

$2.896

100+ parts

-

1k+ parts

$2.780

10k+ parts

$2.780

327

$2.896

-

$2.780

$2.780

One Stop Electronics

USA . 519 parts In-Stock

1+ parts

$8.000

100+ parts

-

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519

$8.000

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AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$15.843

100+ parts

-

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702

$15.843

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Parana Technologies

USA . 1,129 parts In-Stock

1+ parts

$28.353

100+ parts

-

1k+ parts

$46.519

10k+ parts

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1,129

$28.353

-

$46.519

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DigiPath Technology Company

USA . 1,489 parts In-Stock

1+ parts

$31.220

100+ parts

-

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10k+ parts

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1,489

$31.220

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ChromeModa Solutions

Germany . 6,511 parts In-Stock

1+ parts

$31.857

100+ parts

$26.123

1k+ parts

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10k+ parts

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6,511

$31.857

$26.123

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IDEA Electronic Components Group

UK . 2,170 parts In-Stock

1+ parts

$31.857

100+ parts

$30.264

1k+ parts

$28.671

10k+ parts

-

2,170

$31.857

$30.264

$28.671

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Corphita

USA . 3,288 parts In-Stock

1+ parts

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3,288

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Microchip USA

USA . 1,188 parts In-Stock

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1,188

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74LVC126ADE4 Bus Driver & Transceivers. This versatile component offers fast propagation delay, low power consumption, and a compact design, making it ideal for a wide range of applications. From automotive to industrial electronics, this product provides exceptional value and performance that will exceed your expectations. Trust Texas Instruments for innovative solutions that drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB, making the product more compact and cost-effective.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, which can help in reducing power consumption and heat generation, making it energy-efficient.

Output Characteristics: 3-STATE

3-state output allows for efficient control of multiple devices on a bus line, improving overall system performance and flexibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and suitable for various applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC126ADE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LVC126ADE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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