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SN74LVC10ADBRE4

Texas Instruments

SN74LVC10ADBRE4 by Texas Instruments

SN74LVC10ADBRE4 by Texas Instruments is a Logic Gates IC with 3 functions and inputs, operating at 1.8V to 3.6V supply voltage. It offers fast propagation delay of 6 ns at 3.3V, making it suitable for automotive applications due to its small outline package and wide temperature range (-40°C to 125°C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,758 parts In-Stock

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8,758

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Digiode

USA . 3,428 parts In-Stock

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3,428

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$17.514

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530

$17.514

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Parana Technologies

USA . 693 parts In-Stock

1+ parts

$19.134

100+ parts

$1,776.892

1k+ parts

$17.221

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-

693

$19.134

$1,776.892

$17.221

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DigiPath Technology Company

USA . 88 parts In-Stock

1+ parts

$21.069

100+ parts

$19.383

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88

$21.069

$19.383

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ChromeModa Solutions

Germany . 3,888 parts In-Stock

1+ parts

$21.499

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$17.629

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3,888

$21.499

$17.629

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IDEA Electronic Components Group

UK . 1,362 parts In-Stock

1+ parts

$21.499

100+ parts

$20.424

1k+ parts

$19.349

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1,362

$21.499

$20.424

$19.349

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Corohmni

South Africa . 371 parts In-Stock

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$28.764

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371

$28.764

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Ampacity Inc.

Singapore . 771 parts In-Stock

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$53.000

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771

$53.000

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One Stop Electronics

USA . 959 parts In-Stock

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$62.000

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959

$62.000

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Component Stockers USA

USA . 672 parts In-Stock

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$99.990

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672

$99.990

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Continental Prestige Electronics

USA . 4,845 parts In-Stock

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Argo Parts USA

USA . 2,396 parts In-Stock

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Microchip USA

USA . 2,212 parts In-Stock

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Corphita

USA . 1,594 parts In-Stock

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1,594

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Bastille Electronics

Australia . 37 parts In-Stock

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37

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Overview

Discover the innovative SN74LVC10ADBRE4 by Texas Instruments, a high-quality logic gate that offers impeccable performance and reliability. With a wide range of applications in various industries, this product provides customers with unparalleled value and benefits. The advanced technology and expertise of Texas Instruments guarantee top-notch quality and efficiency, making the SN74LVC10ADBRE4 a smart choice for all your logic gate needs. Experience the advantages of this product today and see the difference it can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the logic gates, ensuring a long lifespan.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures quick response times, making this product suitable for applications requiring fast processing.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and heat generation, making it suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in challenging environments, making this product reliable in various conditions.

Technical Specifications

Logic Gates SN74LVC10ADBRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

12.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LVC10ADBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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