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SN74LVC08ADBRG4

Texas Instruments

SN74LVC08ADBRG4 by Texas Instruments

SN74LVC08ADBRG4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 1.65V to 3.6V, with a propagation delay of 11.3ns at nominal supply. Ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 50,500 parts In-Stock

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Vyrian

USA . 7,518 parts In-Stock

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7,518

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Digiode

USA . 2,865 parts In-Stock

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2,865

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ComSIT Distribution GmbH

Germany . 136 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,587 parts In-Stock

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$4.000

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1,587

$4.000

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AZTECH Wire

Italy . 696 parts In-Stock

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$18.264

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696

$18.264

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Parana Technologies

USA . 907 parts In-Stock

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$18.586

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$1,725.980

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$16.727

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907

$18.586

$1,725.980

$16.727

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One Stop Electronics

USA . 1,027 parts In-Stock

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$20.000

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1,027

$20.000

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DigiPath Technology Company

USA . 2,139 parts In-Stock

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$20.465

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2,139

$20.465

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ChromeModa Solutions

Germany . 760 parts In-Stock

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$20.883

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$17.124

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760

$20.883

$17.124

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IDEA Electronic Components Group

UK . 587 parts In-Stock

1+ parts

$20.883

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$19.839

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$18.795

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587

$20.883

$19.839

$18.795

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Microchip USA

USA . 4,911 parts In-Stock

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Corphita

USA . 4,535 parts In-Stock

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Perfect Parts

USA . 4,489 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Elevate your electronic projects with the SN74LVC08ADBRG4 Logic Gates by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile component offers a multitude of applications in various fields, providing unmatched performance and precision. With its fast propagation delay and low power consumption, this logic gate ensures efficient operation while maintaining high accuracy. Upgrade your designs today with the SN74LVC08ADBRG4 and experience the superior quality and value that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring reliable performance in various environmental conditions.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional logic gates, optimizing circuit design and efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates reliable and efficient for various applications.

Technical Specifications

Logic Gates SN74LVC08ADBRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74LVC08ADBRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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