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SN74LVC04AQDRG4Q1

Texas Instruments

SN74LVC04AQDRG4Q1 by Texas Instruments

SN74LVC04AQDRG4Q1 by Texas Instruments is a CMOS logic gate with 6 functions, 8 ns propagation delay, and 1.8V nominal voltage. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,792 parts In-Stock

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Digiode

USA . 3,577 parts In-Stock

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AZTECH Wire

Italy . 681 parts In-Stock

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$9.849

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Parana Technologies

USA . 1,055 parts In-Stock

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$12.991

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$13.483

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DigiPath Technology Company

USA . 1,927 parts In-Stock

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ChromeModa Solutions

Germany . 6,165 parts In-Stock

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$14.597

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$11.970

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IDEA Electronic Components Group

UK . 355 parts In-Stock

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$14.597

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One Stop Electronics

USA . 241 parts In-Stock

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Microchip USA

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SN74LVC04AQDRG4Q1 Logic Gates. Designed for automotive applications, this product offers a fast propagation delay of 4.5 ns and features a small outline package style for easy installation. With 6 functions in one component, this logic gate provides exceptional performance and efficiency. Trust Texas Instruments for cutting-edge technology and superior products that deliver unparalleled value to customers in the automotive industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for automotive applications.

Propagation Delay At Nominal Supply: 4.5 ns

With a low propagation delay, this logic gate ensures fast processing speed, suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable, this logic gate is easy to install on PCBs, saving space and facilitating automated assembly processes.

No. of Functions: 6

With multiple functions integrated into a single component, this logic gate offers efficiency in circuit design and saves on component count.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this logic gate suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V, this logic gate is energy-efficient and suitable for low-power applications.

Load Capacitance (CL): 50 pF

With a low load capacitance, this logic gate can drive capacitive loads efficiently, ensuring signal integrity in high-frequency applications.

Power Supplies (V): 3.3

Accepting a supply voltage of 3.3V, this logic gate is compatible with standard power sources, making it versatile in various circuit configurations.

No. of Terminals: 14

With a sufficient number of terminals, this logic gate offers easy connectivity and compatibility with standard PCB layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling compact and efficient circuit designs.

Maximum I (ol): 24 Amp

With a high output current capability of 24A, this logic gate can drive heavy loads, making it suitable for power applications.

Propagation Delay (tpd): 8 ns

Although slightly higher, the propagation delay of 8ns is still fast enough for most applications, ensuring quick signal processing.

Maximum Operating Temperature: 125 °C

Operating at a high temperature of 125°C, this logic gate is suitable for automotive and industrial applications that require robust performance in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate can function reliably in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides excellent corrosion resistance and ensures long-term reliability in various operating environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and ensures secure connection for reliable operation.

Maximum Seated Height: 1.75 mm

With a low seated height of 1.75mm, this logic gate is suitable for compact designs where space is limited.

Width: 3.9 mm

The narrow width of 3.9mm allows for dense packing of components on the PCB, optimizing space utilization in circuit layouts.

Minimum Supply Voltage (Vsup): 1.65 V

The minimum supply voltage of 1.65V ensures compatibility with low-power applications and enables operation in scenarios with limited power availability.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds at peak temperature ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables efficient soldering and ensures a strong bond between the component and the PCB during assembly.

Length: 8.65 mm

The length of 8.65mm provides a compact form factor for the logic gate, making it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this logic gate meets stringent temperature and reliability requirements for operation in vehicle systems.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure attachment to the PCB, ensuring reliable electrical connections.

Packing Method: TR

The tape and reel packing method allows for efficient storage, handling, and automated pick-and-place assembly of the logic gates in production processes.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27mm, this logic gate is compatible with common PCB layouts and simplifies the integration process in circuit design.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V, this logic gate offers flexibility in power input options and ensures compatibility with a wide range of operating conditions.

Technical Specifications

Logic Gates SN74LVC04AQDRG4Q1 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LVC04AQDRG4Q1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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