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SN74LV74AQPWRQ1

Texas Instruments

SN74LV74AQPWRQ1 by Texas Instruments

SN74LV74AQPWRQ1 by Texas Instruments is a dual-function latches & flip-flops IC with 18ns propagation delay at 2.5V, suitable for automotive applications. It operates at a max frequency of 45MHz, has a load capacitance of 50pF, and can handle up to 6A output current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,895 parts In-Stock

1+ parts

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3,895

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Vyrian

USA . 3,108 parts In-Stock

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3,108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$7.938

100+ parts

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260

$7.938

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Parana Technologies

USA . 622 parts In-Stock

1+ parts

$18.751

100+ parts

-

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$18.841

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622

$18.751

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$18.841

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DigiPath Technology Company

USA . 1,404 parts In-Stock

1+ parts

$20.648

100+ parts

$18.996

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1,404

$20.648

$18.996

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ChromeModa Solutions

Germany . 1,275 parts In-Stock

1+ parts

$21.069

100+ parts

$17.277

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1,275

$21.069

$17.277

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IDEA Electronic Components Group

UK . 233 parts In-Stock

1+ parts

$21.069

100+ parts

$20.016

1k+ parts

$18.962

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233

$21.069

$20.016

$18.962

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One Stop Electronics

USA . 526 parts In-Stock

1+ parts

$49.000

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526

$49.000

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Corphita

USA . 330 parts In-Stock

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330

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Microchip USA

USA . 259 parts In-Stock

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Overview

Enhance your automotive electronics with the SN74LV74AQPWRQ1 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This latches & flip-flops device offers fast propagation delay and low power consumption, making it ideal for automotive applications. With its compact package and high performance, this product provides exceptional value and efficiency to customers looking for cutting-edge solutions. Upgrade your designs today with the SN74LV74AQPWRQ1 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the latch or flip-flop, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 18 ns

The fast propagation delay of 18ns ensures quick and efficient signal processing, making this latch/flip-flop ideal for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on printed circuit boards, saving space and simplifying the assembly process.

No. of Functions: 2

Having 2 functions in one device provides versatility and flexibility in circuit design, enabling more complex logic operations to be implemented.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the latch/flip-flop meets automotive industry quality standards, making it reliable for automotive applications.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage is compatible with a wide range of power supplies, making the latch/flip-flop versatile and adaptable to different system requirements.

Load Capacitance (CL): 50 pF

The 50pF load capacitance allows for efficient signal transmission and reception, ensuring reliable operation in various circuit configurations.

Power Supplies (V): 3.3

Supporting a power supply voltage of 3.3V, this latch/flip-flop is suitable for use in low-power applications while maintaining high performance.

No. of Terminals: 14

With 14 terminals, this latch/flip-flop offers multiple connection points for interfacing with other components, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum I (ol): 6 Amp

The high maximum output current of 6A allows the latch/flip-flop to drive larger loads and handle increased power requirements.

Propagation Delay (tpd): 23 ns

With a propagation delay of 23ns, this latch/flip-flop offers fast response times for efficient data processing and signal propagation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable operation in harsh environmental conditions, making it suitable for industrial and automotive applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate timing and synchronization of signals, enabling precise control over the latch/flip-flop operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the latch/flip-flop to function in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides additional flexibility in circuit board layout and component placement, allowing for more efficient design configurations.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm helps in reducing the overall profile of the electronic system, making it suitable for compact designs.

Width: 4.4 mm

The narrow width of 4.4mm enables the latch/flip-flop to fit in tight spaces and densely populated PCBs, maximizing space utilization.

Output Polarity: COMPLEMENTARY

The complementary output polarity allows for more versatile logic operations and signal processing, expanding the range of applications for this latch/flip-flop.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V ensures that the latch/flip-flop can operate efficiently in low-power conditions, conserving energy and optimizing performance.

Length: 5 mm

The compact length of 5mm helps in optimizing the overall size of the electronic system, making this latch/flip-flop suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the latch/flip-flop can withstand the demanding temperature conditions in automotive environments, making it reliable for automotive electronics.

Maximum Frequency At Nominal Supply: 45000000 Hz

With a maximum frequency of 45MHz at nominal supply voltage, this latch/flip-flop offers high-speed performance for demanding applications that require rapid data processing.

Technology: CMOS

The CMOS technology used in this latch/flip-flop provides low power consumption and high noise immunity, making it energy-efficient and reliable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly on PCBs, ensuring a secure and reliable connection for the latch/flip-flop.

Packing Method: TR

The TR packing method ensures convenient storage, handling, and transportation of multiple latch/flip-flop units, making it suitable for mass production and assembly.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density PCB layouts, enabling more compact and space-efficient electronic designs.

Minimum fmax: 75 MHz

Supporting a minimum fmax of 75MHz ensures high-speed performance and efficient data processing capabilities, making this latch/flip-flop suitable for advanced digital systems.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources, providing flexibility in system design and integration.

Technical Specifications

Latches & Flip-Flops SN74LV74AQPWRQ1 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

75 MHz

Trade Compliance

SN74LV74AQPWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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