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SN74LV540ANSRE4

Texas Instruments

SN74LV540ANSRE4 by Texas Instruments

SN74LV540ANSRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 12 ns at 2.5V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity inverted, and supports a load capacitance of 50 pF. This CMOS technology device has dual terminal position in small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,649 parts In-Stock

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4,649

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Vyrian

USA . 4,492 parts In-Stock

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4,492

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Distributors (Availability)

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Andel Nordic

Denmark . 340 parts In-Stock

1+ parts

$8.017

100+ parts

-

1k+ parts

$7.696

10k+ parts

$7.696

340

$8.017

-

$7.696

$7.696

AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$15.291

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400

$15.291

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Parana Technologies

USA . 1,050 parts In-Stock

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$23.492

100+ parts

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$24.119

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1,050

$23.492

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$24.119

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ChromeModa Solutions

Germany . 4,523 parts In-Stock

1+ parts

$26.395

100+ parts

$21.644

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4,523

$26.395

$21.644

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IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$26.395

100+ parts

$25.075

1k+ parts

$23.756

10k+ parts

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905

$26.395

$25.075

$23.756

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One Stop Electronics

USA . 1,173 parts In-Stock

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$27.000

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1,173

$27.000

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Corphita

USA . 4,882 parts In-Stock

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4,882

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Microchip USA

USA . 1,257 parts In-Stock

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1,257

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DigiPath Technology Company

USA . 954 parts In-Stock

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$23.798

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954

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$23.798

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74LV540ANSRE4 Bus Driver & Transceivers. This innovative product offers customers a seamless experience with its advanced technology and robust design. Ideal for a wide range of applications, this versatile component provides exceptional value and performance. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the internal components of the bus driver & transceivers, making it a reliable and long-lasting option.

Propagation Delay At Nominal Supply: 12 ns

With a low propagation delay of 12 ns at nominal supply voltage, this product ensures fast and efficient signal transmission, ideal for high-speed communication applications.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage ensures compatibility with a wide range of systems and devices, providing flexibility in design and integration.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance output, enabling multiple drivers to be connected to a common bus without causing bus contention issues.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it suitable for battery-powered applications and robust performance in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74LV540ANSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74LV540ANSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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